JPS5122345B2 - - Google Patents
Info
- Publication number
- JPS5122345B2 JPS5122345B2 JP48129829A JP12982973A JPS5122345B2 JP S5122345 B2 JPS5122345 B2 JP S5122345B2 JP 48129829 A JP48129829 A JP 48129829A JP 12982973 A JP12982973 A JP 12982973A JP S5122345 B2 JPS5122345 B2 JP S5122345B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y15/00—Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07392—Multiple probes manipulating each probe element or tip individually
Landscapes
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Molecular Biology (AREA)
- General Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Measurement Of Resistance Or Impedance (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US00318155A US3806800A (en) | 1972-12-26 | 1972-12-26 | Method and apparatus for determining the location of electrically conductive members on a structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4991775A JPS4991775A (US20080094685A1-20080424-C00004.png) | 1974-09-02 |
| JPS5122345B2 true JPS5122345B2 (US20080094685A1-20080424-C00004.png) | 1976-07-09 |
Family
ID=23236906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48129829A Expired JPS5122345B2 (US20080094685A1-20080424-C00004.png) | 1972-12-26 | 1973-11-20 |
Country Status (6)
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51145158U (US20080094685A1-20080424-C00004.png) * | 1975-05-16 | 1976-11-22 |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4038599A (en) * | 1974-12-30 | 1977-07-26 | International Business Machines Corporation | High density wafer contacting and test system |
| US4019129A (en) * | 1975-06-02 | 1977-04-19 | Bell Telephone Laboratories, Incorporated | Metallic plating testing apparatus |
| US4038501A (en) * | 1975-07-10 | 1977-07-26 | Volk Victor F | Apparatus and method for automatically connecting to the individual conductors of a multiconductor cable |
| US4052793A (en) * | 1976-10-04 | 1977-10-11 | International Business Machines Corporation | Method of obtaining proper probe alignment in a multiple contact environment |
| US4099119A (en) * | 1977-02-03 | 1978-07-04 | Honeywell Inc. | Probe apparatus for in place testing of electrical circuit boards |
| US4214201A (en) * | 1978-02-24 | 1980-07-22 | Teradyne, Inc. | Integrated circuit testing probe |
| US4218745A (en) * | 1978-09-11 | 1980-08-19 | Lockheed Corporation | Microcomputer assisted electrical harness fabrication and testing system |
| JPS55164376A (en) * | 1979-06-11 | 1980-12-22 | Nippon Telegr & Teleph Corp <Ntt> | Integrated circuit testing unit |
| DE2938567C2 (de) * | 1979-09-24 | 1982-04-29 | Siemens AG, 1000 Berlin und 8000 München | Gehäuse für hochintegrierte Schaltkreise |
| US4463310A (en) * | 1980-07-11 | 1984-07-31 | Rca Corporation | Apparatus for detecting the presence of components on a printed circuit board |
| US4443756A (en) * | 1980-11-25 | 1984-04-17 | Lightbody James D | Apparatus and method for testing circuit boards |
| DE3223664A1 (de) * | 1982-06-24 | 1983-12-29 | Siemens AG, 1000 Berlin und 8000 München | Messanordnung fuer duenne schichten und duennschichtbauelemente auf scheibenfoermigen substraten |
| DE3235119A1 (de) * | 1982-09-22 | 1984-03-22 | Siemens AG, 1000 Berlin und 8000 München | Anordnung fuer die pruefung von mikroverdrahtungen und verfahren zu ihrem betrieb |
| US4565966A (en) * | 1983-03-07 | 1986-01-21 | Kollmorgen Technologies Corporation | Method and apparatus for testing of electrical interconnection networks |
| US4633175A (en) * | 1984-11-23 | 1986-12-30 | Avx Corporation | Testing method and apparatus for electronic components |
| JPS62106170U (US20080094685A1-20080424-C00004.png) * | 1985-12-23 | 1987-07-07 | ||
| EP0285799B1 (de) * | 1987-03-31 | 1993-07-28 | Siemens Aktiengesellschaft | Vorrichtung für die elektrische Funktionsprüfung von Verdrahtungsfeldern, insbesondere von Leiterplatten |
| US4949035A (en) * | 1989-01-06 | 1990-08-14 | Digital Equipment Corporation | Connector alignment verification and monitoring system |
| US5235740A (en) * | 1991-03-22 | 1993-08-17 | International Business Machines Corporation | Press with pin detection for interference connectors |
| JPH05166903A (ja) * | 1991-12-12 | 1993-07-02 | Mitsubishi Electric Corp | 半導体検査装置 |
| US5420520A (en) * | 1993-06-11 | 1995-05-30 | International Business Machines Corporation | Method and apparatus for testing of integrated circuit chips |
| JPH0763788A (ja) * | 1993-08-21 | 1995-03-10 | Hewlett Packard Co <Hp> | プローブおよび電気部品／回路検査装置ならびに電気部品／回路検査方法 |
| US5543724A (en) * | 1994-10-03 | 1996-08-06 | Motorola, Inc. | Method and apparatus for locating conductive features and testing semiconductor devices |
| US5861743A (en) * | 1995-12-21 | 1999-01-19 | Genrad, Inc. | Hybrid scanner for use in an improved MDA tester |
| WO1997038324A1 (en) * | 1996-04-09 | 1997-10-16 | Phase Metrics | Testing of multiple magnetic recording heads |
| US6140827A (en) * | 1997-12-18 | 2000-10-31 | Micron Technology, Inc. | Method and apparatus for testing bumped die |
| US6255827B1 (en) | 1999-04-30 | 2001-07-03 | International Business Machines Corporation | Search routine for 2-point electrical tester |
| US20070245553A1 (en) * | 1999-05-27 | 2007-10-25 | Chong Fu C | Fine pitch microfabricated spring contact structure & method |
| US7382142B2 (en) | 2000-05-23 | 2008-06-03 | Nanonexus, Inc. | High density interconnect system having rapid fabrication cycle |
| US7247035B2 (en) * | 2000-06-20 | 2007-07-24 | Nanonexus, Inc. | Enhanced stress metal spring contactor |
| US6710609B2 (en) * | 2002-07-15 | 2004-03-23 | Nanonexus, Inc. | Mosaic decal probe |
| US6799976B1 (en) * | 1999-07-28 | 2004-10-05 | Nanonexus, Inc. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
| US6812718B1 (en) | 1999-05-27 | 2004-11-02 | Nanonexus, Inc. | Massively parallel interface for electronic circuits |
| US7349223B2 (en) | 2000-05-23 | 2008-03-25 | Nanonexus, Inc. | Enhanced compliant probe card systems having improved planarity |
| US6297653B1 (en) * | 1999-06-28 | 2001-10-02 | Micron Technology, Inc. | Interconnect and carrier with resistivity measuring contacts for testing semiconductor components |
| US20050068054A1 (en) * | 2000-05-23 | 2005-03-31 | Sammy Mok | Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies |
| US7579848B2 (en) * | 2000-05-23 | 2009-08-25 | Nanonexus, Inc. | High density interconnect system for IC packages and interconnect assemblies |
| US7952373B2 (en) | 2000-05-23 | 2011-05-31 | Verigy (Singapore) Pte. Ltd. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
| CN1575350A (zh) * | 2001-08-24 | 2005-02-02 | 纳米纳克斯公司 | 用于在溅射薄膜中产生均匀、各向同性应力的方法和装置 |
| US6933730B2 (en) * | 2003-10-09 | 2005-08-23 | Agilent Technologies, Inc. | Methods and apparatus for testing continuity of electrical paths through connectors of circuit assemblies |
| US9668356B2 (en) * | 2013-10-01 | 2017-05-30 | Sierra Wireless, Inc. | Method and apparatus for electrical keying of an integrated circuit package having rotationally symmetric footprint |
| CN109765479B (zh) * | 2019-01-28 | 2021-10-01 | 合肥京东方视讯科技有限公司 | 一种电路板缺件检测装置和方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2887622A (en) * | 1953-08-07 | 1959-05-19 | Charles C Rayburn | Electrical circuit pattern tester |
| US2977530A (en) * | 1958-05-16 | 1961-03-28 | Walter R Oreamuno & Co | Circuit indicator device for wired control panels of business machines |
| US3052842A (en) * | 1959-10-15 | 1962-09-04 | Lockheed Aircraft Corp | Patchcord connection aid and checking system |
| US3217245A (en) * | 1962-03-27 | 1965-11-09 | Whitney Blake Co | Method of testing a packaged insulated cable wound on an annular core |
| US3528104A (en) * | 1968-03-08 | 1970-09-08 | Western Electric Co | Bridge circuit methods of and apparatus for testing and locating faults in electrical circuits |
| DE1800657C3 (de) * | 1968-10-02 | 1975-05-22 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Kontaktvorrichtung, insbesondere zur elektrischen Prüfung der Leitungszüge gedruckter oder geätzter Schaltungsplatten |
| GB1263644A (en) * | 1969-08-07 | 1972-02-16 | Olivetti & Co Spa | Apparatus for automatically testing electronic circuits |
| US3654585A (en) * | 1970-03-11 | 1972-04-04 | Brooks Research And Mfg Inc | Coordinate conversion for the testing of printed circuit boards |
-
1972
- 1972-12-26 US US00318155A patent/US3806800A/en not_active Expired - Lifetime
-
1973
- 1973-11-19 CA CA186,121A patent/CA1003045A/en not_active Expired
- 1973-11-20 FR FR7342433A patent/FR2211658B1/fr not_active Expired
- 1973-11-20 JP JP48129829A patent/JPS5122345B2/ja not_active Expired
- 1973-11-29 GB GB5540273A patent/GB1431226A/en not_active Expired
- 1973-12-06 DE DE2360801A patent/DE2360801C2/de not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51145158U (US20080094685A1-20080424-C00004.png) * | 1975-05-16 | 1976-11-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| CA1003045A (en) | 1977-01-04 |
| JPS4991775A (US20080094685A1-20080424-C00004.png) | 1974-09-02 |
| US3806800A (en) | 1974-04-23 |
| DE2360801C2 (de) | 1985-08-22 |
| DE2360801A1 (de) | 1974-06-27 |
| GB1431226A (en) | 1976-04-07 |
| FR2211658B1 (US20080094685A1-20080424-C00004.png) | 1978-12-01 |
| FR2211658A1 (US20080094685A1-20080424-C00004.png) | 1974-07-19 |
