JPS51162670U - - Google Patents

Info

Publication number
JPS51162670U
JPS51162670U JP8187675U JP8187675U JPS51162670U JP S51162670 U JPS51162670 U JP S51162670U JP 8187675 U JP8187675 U JP 8187675U JP 8187675 U JP8187675 U JP 8187675U JP S51162670 U JPS51162670 U JP S51162670U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8187675U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8187675U priority Critical patent/JPS51162670U/ja
Publication of JPS51162670U publication Critical patent/JPS51162670U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP8187675U 1975-06-18 1975-06-18 Pending JPS51162670U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8187675U JPS51162670U (fr) 1975-06-18 1975-06-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8187675U JPS51162670U (fr) 1975-06-18 1975-06-18

Publications (1)

Publication Number Publication Date
JPS51162670U true JPS51162670U (fr) 1976-12-24

Family

ID=28561916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8187675U Pending JPS51162670U (fr) 1975-06-18 1975-06-18

Country Status (1)

Country Link
JP (1) JPS51162670U (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6070783A (ja) * 1983-09-27 1985-04-22 Sharp Corp 発光ダイオ−ド表示装置
JP2005020038A (ja) * 2004-10-18 2005-01-20 Nichia Chem Ind Ltd 発光ダイオード

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6070783A (ja) * 1983-09-27 1985-04-22 Sharp Corp 発光ダイオ−ド表示装置
JP2005020038A (ja) * 2004-10-18 2005-01-20 Nichia Chem Ind Ltd 発光ダイオード
JP4626258B2 (ja) * 2004-10-18 2011-02-02 日亜化学工業株式会社 発光ダイオード

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