JPS5116264B2 - - Google Patents

Info

Publication number
JPS5116264B2
JPS5116264B2 JP46076360A JP7636071A JPS5116264B2 JP S5116264 B2 JPS5116264 B2 JP S5116264B2 JP 46076360 A JP46076360 A JP 46076360A JP 7636071 A JP7636071 A JP 7636071A JP S5116264 B2 JPS5116264 B2 JP S5116264B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP46076360A
Other languages
Japanese (ja)
Other versions
JPS4843278A (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP46076360A priority Critical patent/JPS5116264B2/ja
Priority to DE2247159A priority patent/DE2247159C3/de
Priority to DE2265274A priority patent/DE2265274C2/de
Priority to DE2265208A priority patent/DE2265208C2/de
Priority to CA152,747A priority patent/CA987790A/en
Publication of JPS4843278A publication Critical patent/JPS4843278A/ja
Priority to US461117A priority patent/US3913127A/en
Publication of JPS5116264B2 publication Critical patent/JPS5116264B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/074—Stacked arrangements of non-apertured devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Thyristors (AREA)
JP46076360A 1971-10-01 1971-10-01 Expired JPS5116264B2 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP46076360A JPS5116264B2 (fr) 1971-10-01 1971-10-01
DE2247159A DE2247159C3 (de) 1971-10-01 1972-09-26 Hochspannungs-Halbleitergleichrichter
DE2265274A DE2265274C2 (de) 1971-10-01 1972-09-26 Hochspannungs-Halbleitergleichrichter
DE2265208A DE2265208C2 (de) 1971-10-01 1972-09-26 Hochspannungs-Halbleitergleichrichter
CA152,747A CA987790A (en) 1971-10-01 1972-09-28 High voltage semiconductor rectifier
US461117A US3913127A (en) 1971-10-01 1974-04-15 Glass encapsulated semiconductor device containing cylindrical stack of semiconductor pellets

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP46076360A JPS5116264B2 (fr) 1971-10-01 1971-10-01

Publications (2)

Publication Number Publication Date
JPS4843278A JPS4843278A (fr) 1973-06-22
JPS5116264B2 true JPS5116264B2 (fr) 1976-05-22

Family

ID=13603176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP46076360A Expired JPS5116264B2 (fr) 1971-10-01 1971-10-01

Country Status (3)

Country Link
JP (1) JPS5116264B2 (fr)
CA (1) CA987790A (fr)
DE (3) DE2265208C2 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59102130U (ja) * 1982-12-28 1984-07-10 株式会社高岳製作所 容器の除湿装置
JPH022414Y2 (fr) * 1982-08-04 1990-01-22
JPH0340338Y2 (fr) * 1982-10-22 1991-08-26

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5150664A (en) * 1974-10-30 1976-05-04 Hitachi Ltd Handotaisochino seizohoho
JPS53975A (en) * 1976-06-25 1978-01-07 Hitachi Ltd Glass-sealed type semiconductor device
JPS54978A (en) * 1977-06-06 1979-01-06 Hitachi Ltd Semiconductor device of glass seal type
JPS53115023A (en) * 1978-02-14 1978-10-07 Sharp Corp Preparing high voltage rectifier
JPS58176957A (ja) * 1982-04-12 1983-10-17 Hitachi Ltd ガラスモ−ルド型半導体装置
JPS58163013U (ja) * 1982-04-26 1983-10-29 株式会社日立製作所 多チヤンネル音響機器のフアンクシヨン間音もれ防止回路
JPS59198740A (ja) * 1983-04-25 1984-11-10 Mitsubishi Electric Corp 樹脂封止形半導体複合素子
DE4417164C1 (de) * 1994-05-17 1995-06-22 Bosch Gmbh Robert Hochspannungskippdiode insb. geeignet als Zündspannungsverteiler eines Verbrennungsmotors
JP4363467B2 (ja) 2007-07-05 2009-11-11 ソニー株式会社 蛍光体とこれを用いた蛍光ランプ、並びに、蛍光ランプを用いた表示装置及び照明装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL98125C (fr) * 1954-08-26 1900-01-01
DE1303509B (fr) * 1959-09-22 1972-07-13 Carman Laboratories Inc
US3363150A (en) * 1964-05-25 1968-01-09 Gen Electric Glass encapsulated double heat sink diode assembly
NL129867C (fr) 1964-08-07 1900-01-01
DE1808666B2 (de) * 1967-11-15 1972-07-27 Mitsubishi Denki K.K., Tokio Halbleiterelement
US3601667A (en) * 1968-12-09 1971-08-24 Gen Electric A semiconductor device with a heat sink having a foot portion
DE1939900A1 (de) * 1969-08-06 1971-02-18 Licentia Gmbh Selengleichrichter mit einem oder mehreren Plattenstapeln
US3771025A (en) 1969-10-02 1973-11-06 Gen Electric Semiconductor device including low impedance connections

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH022414Y2 (fr) * 1982-08-04 1990-01-22
JPH0340338Y2 (fr) * 1982-10-22 1991-08-26
JPS59102130U (ja) * 1982-12-28 1984-07-10 株式会社高岳製作所 容器の除湿装置

Also Published As

Publication number Publication date
DE2247159C3 (de) 1985-06-20
JPS4843278A (fr) 1973-06-22
CA987790A (en) 1976-04-20
DE2265274A1 (de) 1977-04-07
DE2247159A1 (de) 1973-04-12
DE2265208C2 (de) 1981-12-24
DE2247159B2 (de) 1977-04-21
DE2265274C2 (de) 1984-01-12
DE2265208A1 (de) 1976-12-23

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