JPS5116264B2 - - Google Patents

Info

Publication number
JPS5116264B2
JPS5116264B2 JP46076360A JP7636071A JPS5116264B2 JP S5116264 B2 JPS5116264 B2 JP S5116264B2 JP 46076360 A JP46076360 A JP 46076360A JP 7636071 A JP7636071 A JP 7636071A JP S5116264 B2 JPS5116264 B2 JP S5116264B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP46076360A
Other languages
Japanese (ja)
Other versions
JPS4843278A (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP46076360A priority Critical patent/JPS5116264B2/ja
Priority to DE2265208A priority patent/DE2265208C2/de
Priority to DE2265274A priority patent/DE2265274C2/de
Priority to DE2247159A priority patent/DE2247159C3/de
Priority to CA152,747A priority patent/CA987790A/en
Publication of JPS4843278A publication Critical patent/JPS4843278A/ja
Priority to US461117A priority patent/US3913127A/en
Publication of JPS5116264B2 publication Critical patent/JPS5116264B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/074—Stacked arrangements of non-apertured devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Thyristors (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP46076360A 1971-10-01 1971-10-01 Expired JPS5116264B2 (enrdf_load_html_response)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP46076360A JPS5116264B2 (enrdf_load_html_response) 1971-10-01 1971-10-01
DE2265208A DE2265208C2 (de) 1971-10-01 1972-09-26 Hochspannungs-Halbleitergleichrichter
DE2265274A DE2265274C2 (de) 1971-10-01 1972-09-26 Hochspannungs-Halbleitergleichrichter
DE2247159A DE2247159C3 (de) 1971-10-01 1972-09-26 Hochspannungs-Halbleitergleichrichter
CA152,747A CA987790A (en) 1971-10-01 1972-09-28 High voltage semiconductor rectifier
US461117A US3913127A (en) 1971-10-01 1974-04-15 Glass encapsulated semiconductor device containing cylindrical stack of semiconductor pellets

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP46076360A JPS5116264B2 (enrdf_load_html_response) 1971-10-01 1971-10-01

Publications (2)

Publication Number Publication Date
JPS4843278A JPS4843278A (enrdf_load_html_response) 1973-06-22
JPS5116264B2 true JPS5116264B2 (enrdf_load_html_response) 1976-05-22

Family

ID=13603176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP46076360A Expired JPS5116264B2 (enrdf_load_html_response) 1971-10-01 1971-10-01

Country Status (3)

Country Link
JP (1) JPS5116264B2 (enrdf_load_html_response)
CA (1) CA987790A (enrdf_load_html_response)
DE (3) DE2247159C3 (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59102130U (ja) * 1982-12-28 1984-07-10 株式会社高岳製作所 容器の除湿装置

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5150664A (en) * 1974-10-30 1976-05-04 Hitachi Ltd Handotaisochino seizohoho
JPS53975A (en) * 1976-06-25 1978-01-07 Hitachi Ltd Glass-sealed type semiconductor device
JPS54978A (en) * 1977-06-06 1979-01-06 Hitachi Ltd Semiconductor device of glass seal type
JPS53115023A (en) * 1978-02-14 1978-10-07 Sharp Corp Preparing high voltage rectifier
JPS58176957A (ja) * 1982-04-12 1983-10-17 Hitachi Ltd ガラスモ−ルド型半導体装置
JPS58163013U (ja) * 1982-04-26 1983-10-29 株式会社日立製作所 多チヤンネル音響機器のフアンクシヨン間音もれ防止回路
JPS59198740A (ja) * 1983-04-25 1984-11-10 Mitsubishi Electric Corp 樹脂封止形半導体複合素子
DE4417164C1 (de) * 1994-05-17 1995-06-22 Bosch Gmbh Robert Hochspannungskippdiode insb. geeignet als Zündspannungsverteiler eines Verbrennungsmotors
JP4363467B2 (ja) 2007-07-05 2009-11-11 ソニー株式会社 蛍光体とこれを用いた蛍光ランプ、並びに、蛍光ランプを用いた表示装置及び照明装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL98125C (enrdf_load_html_response) * 1954-08-26 1900-01-01
DE1303509B (enrdf_load_html_response) * 1959-09-22 1972-07-13 Carman Laboratories Inc
US3363150A (en) * 1964-05-25 1968-01-09 Gen Electric Glass encapsulated double heat sink diode assembly
NL129867C (enrdf_load_html_response) 1964-08-07 1900-01-01
CH497790A (de) * 1967-11-15 1970-10-15 Mitsubishi Electric Corp Halbleiterelement
US3601667A (en) * 1968-12-09 1971-08-24 Gen Electric A semiconductor device with a heat sink having a foot portion
DE1939900A1 (de) * 1969-08-06 1971-02-18 Licentia Gmbh Selengleichrichter mit einem oder mehreren Plattenstapeln
US3771025A (en) * 1969-10-02 1973-11-06 Gen Electric Semiconductor device including low impedance connections

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59102130U (ja) * 1982-12-28 1984-07-10 株式会社高岳製作所 容器の除湿装置

Also Published As

Publication number Publication date
CA987790A (en) 1976-04-20
DE2247159C3 (de) 1985-06-20
DE2247159B2 (de) 1977-04-21
DE2247159A1 (de) 1973-04-12
DE2265208C2 (de) 1981-12-24
DE2265208A1 (de) 1976-12-23
DE2265274A1 (de) 1977-04-07
JPS4843278A (enrdf_load_html_response) 1973-06-22
DE2265274C2 (de) 1984-01-12

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