JPS51126765A - Resin sealed semiconductor unit manufacturing process - Google Patents

Resin sealed semiconductor unit manufacturing process

Info

Publication number
JPS51126765A
JPS51126765A JP5044975A JP5044975A JPS51126765A JP S51126765 A JPS51126765 A JP S51126765A JP 5044975 A JP5044975 A JP 5044975A JP 5044975 A JP5044975 A JP 5044975A JP S51126765 A JPS51126765 A JP S51126765A
Authority
JP
Japan
Prior art keywords
semiconductor unit
sealed semiconductor
manufacturing process
resin sealed
unit manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5044975A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5241191B2 (enExample
Inventor
Hiroshi Moriguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5044975A priority Critical patent/JPS51126765A/ja
Publication of JPS51126765A publication Critical patent/JPS51126765A/ja
Publication of JPS5241191B2 publication Critical patent/JPS5241191B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP5044975A 1975-04-25 1975-04-25 Resin sealed semiconductor unit manufacturing process Granted JPS51126765A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5044975A JPS51126765A (en) 1975-04-25 1975-04-25 Resin sealed semiconductor unit manufacturing process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5044975A JPS51126765A (en) 1975-04-25 1975-04-25 Resin sealed semiconductor unit manufacturing process

Publications (2)

Publication Number Publication Date
JPS51126765A true JPS51126765A (en) 1976-11-05
JPS5241191B2 JPS5241191B2 (enExample) 1977-10-17

Family

ID=12859161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5044975A Granted JPS51126765A (en) 1975-04-25 1975-04-25 Resin sealed semiconductor unit manufacturing process

Country Status (1)

Country Link
JP (1) JPS51126765A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1215724A1 (en) * 2000-11-20 2002-06-19 Texas Instruments Incorporated Wire bonded semiconductor device with low capacitance coupling

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1215724A1 (en) * 2000-11-20 2002-06-19 Texas Instruments Incorporated Wire bonded semiconductor device with low capacitance coupling
US6822340B2 (en) 2000-11-20 2004-11-23 Texas Instruments Incorporated Low capacitance coupling wire bonded semiconductor device
US7195954B2 (en) 2000-11-20 2007-03-27 Texas Instruments Incorporated Low capacitance coupling wire bonded semiconductor device

Also Published As

Publication number Publication date
JPS5241191B2 (enExample) 1977-10-17

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