JPS51115773A - Connected wiring system of hybrid ic - Google Patents

Connected wiring system of hybrid ic

Info

Publication number
JPS51115773A
JPS51115773A JP50026709A JP2670975A JPS51115773A JP S51115773 A JPS51115773 A JP S51115773A JP 50026709 A JP50026709 A JP 50026709A JP 2670975 A JP2670975 A JP 2670975A JP S51115773 A JPS51115773 A JP S51115773A
Authority
JP
Japan
Prior art keywords
hybrid
wiring system
connected wiring
adhension
singularity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50026709A
Other languages
Japanese (ja)
Inventor
Hiroo Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP50026709A priority Critical patent/JPS51115773A/en
Publication of JPS51115773A publication Critical patent/JPS51115773A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector

Abstract

PURPOSE: To connect electrically using the adhension of a compound, which has a singularity for the conductive direction.
COPYRIGHT: (C)1976,JPO&Japio
JP50026709A 1975-03-04 1975-03-04 Connected wiring system of hybrid ic Pending JPS51115773A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50026709A JPS51115773A (en) 1975-03-04 1975-03-04 Connected wiring system of hybrid ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50026709A JPS51115773A (en) 1975-03-04 1975-03-04 Connected wiring system of hybrid ic

Publications (1)

Publication Number Publication Date
JPS51115773A true JPS51115773A (en) 1976-10-12

Family

ID=12200890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50026709A Pending JPS51115773A (en) 1975-03-04 1975-03-04 Connected wiring system of hybrid ic

Country Status (1)

Country Link
JP (1) JPS51115773A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61186061A (en) * 1985-02-13 1986-08-19 Fuji Xerox Co Ltd Device for driving contact type image sensor or thermal head or the like

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61186061A (en) * 1985-02-13 1986-08-19 Fuji Xerox Co Ltd Device for driving contact type image sensor or thermal head or the like

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