JPS5111168A - - Google Patents
Info
- Publication number
- JPS5111168A JPS5111168A JP49082158A JP8215874A JPS5111168A JP S5111168 A JPS5111168 A JP S5111168A JP 49082158 A JP49082158 A JP 49082158A JP 8215874 A JP8215874 A JP 8215874A JP S5111168 A JPS5111168 A JP S5111168A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49082158A JPS5111168A (de) | 1974-07-19 | 1974-07-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49082158A JPS5111168A (de) | 1974-07-19 | 1974-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5111168A true JPS5111168A (de) | 1976-01-29 |
Family
ID=13766615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49082158A Pending JPS5111168A (de) | 1974-07-19 | 1974-07-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5111168A (de) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55124248A (en) * | 1979-03-20 | 1980-09-25 | Nec Corp | Leadless package |
| JPS5853848A (ja) * | 1981-09-25 | 1983-03-30 | Nec Corp | チツプキヤリア |
| JPS5983015U (ja) * | 1982-11-25 | 1984-06-05 | 株式会社タムラ製作所 | 小型変圧器 |
| JPS59142219U (ja) * | 1982-11-25 | 1984-09-22 | 林 光夫 | トラツクの土建用荷台装置 |
| EP0196085A2 (de) * | 1985-03-28 | 1986-10-01 | Eisai Co., Ltd. | Ubidecarenon enthaltende Mittel mit erhöhter Absorption |
-
1974
- 1974-07-19 JP JP49082158A patent/JPS5111168A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55124248A (en) * | 1979-03-20 | 1980-09-25 | Nec Corp | Leadless package |
| JPS5853848A (ja) * | 1981-09-25 | 1983-03-30 | Nec Corp | チツプキヤリア |
| JPS5983015U (ja) * | 1982-11-25 | 1984-06-05 | 株式会社タムラ製作所 | 小型変圧器 |
| JPS59142219U (ja) * | 1982-11-25 | 1984-09-22 | 林 光夫 | トラツクの土建用荷台装置 |
| JPS6314414Y2 (de) * | 1982-11-25 | 1988-04-22 | ||
| EP0196085A2 (de) * | 1985-03-28 | 1986-10-01 | Eisai Co., Ltd. | Ubidecarenon enthaltende Mittel mit erhöhter Absorption |