JPS51110985A - - Google Patents

Info

Publication number
JPS51110985A
JPS51110985A JP50036364A JP3636475A JPS51110985A JP S51110985 A JPS51110985 A JP S51110985A JP 50036364 A JP50036364 A JP 50036364A JP 3636475 A JP3636475 A JP 3636475A JP S51110985 A JPS51110985 A JP S51110985A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50036364A
Other languages
Japanese (ja)
Other versions
JPS5628383B2 (de
Inventor
Momoki Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP3636475A priority Critical patent/JPS5628383B2/ja
Publication of JPS51110985A publication Critical patent/JPS51110985A/ja
Publication of JPS5628383B2 publication Critical patent/JPS5628383B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/24137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Photovoltaic Devices (AREA)
JP3636475A 1975-03-25 1975-03-25 Expired JPS5628383B2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3636475A JPS5628383B2 (de) 1975-03-25 1975-03-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3636475A JPS5628383B2 (de) 1975-03-25 1975-03-25

Publications (2)

Publication Number Publication Date
JPS51110985A true JPS51110985A (de) 1976-09-30
JPS5628383B2 JPS5628383B2 (de) 1981-07-01

Family

ID=12467766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3636475A Expired JPS5628383B2 (de) 1975-03-25 1975-03-25

Country Status (1)

Country Link
JP (1) JPS5628383B2 (de)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5384495A (en) * 1976-12-29 1978-07-25 Japan Solar Energy Semiconductor electrode and method of forming same
JPS54179075U (de) * 1978-06-07 1979-12-18
JPS57172777A (en) * 1981-04-15 1982-10-23 Nippon Sheet Glass Co Ltd Modularization of photocell
JPS58190050A (ja) * 1982-04-30 1983-11-05 Nec Home Electronics Ltd ダイオ−ド組立方法
JPS59211286A (ja) * 1983-05-17 1984-11-30 Canon Inc 太陽電池ユニツト
JPS604270A (ja) * 1983-06-22 1985-01-10 Hitachi Ltd 太陽電池の製造方法
JPS60107872A (ja) * 1983-11-16 1985-06-13 Kanegafuchi Chem Ind Co Ltd 光起電力装置
JPS6182485A (ja) * 1984-09-29 1986-04-26 Toshiba Corp 太陽電池パネル
JPH01121959U (de) * 1988-02-10 1989-08-18
JP2004200515A (ja) * 2002-12-19 2004-07-15 Kyocera Corp 太陽電池モジュール
JP2004247402A (ja) * 2003-02-12 2004-09-02 Sanyo Electric Co Ltd 太陽電池モジュールおよびその製造方法
JP2008508673A (ja) * 2004-07-27 2008-03-21 ケンブリッジ ディスプレイ テクノロジー リミテッド 有機光−電子装置用積層相互接続
JP2014075430A (ja) * 2012-10-03 2014-04-24 Sharp Corp 太陽電池モジュール
US8993364B2 (en) 2009-02-02 2015-03-31 Hanergy Hi-Tech Power (Hk) Limited Integrated thin film solar cell interconnection
US9362433B2 (en) 2013-01-28 2016-06-07 Hanergy Hi-Tech Power (Hk) Limited Photovoltaic interconnect systems, devices, and methods
US9385254B2 (en) 2012-04-17 2016-07-05 Hanergy Hi-Tech Power (Hk) Limited Integrated thin film solar cell interconnection
JP2019208015A (ja) * 2018-03-28 2019-12-05 ザ・ボーイング・カンパニーＴｈｅＢｏｅｉｎｇ Ｃｏｍｐａｎｙ 剛性パネルソーラーアレイのための配線
DE102013219526B4 (de) 2013-09-27 2022-10-13 Meyer Burger (Germany) Gmbh Solarzellenverbund mit Verbindungselement und Verfahren zum Herstellen eines Solarzellenverbunds

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5384495A (en) * 1976-12-29 1978-07-25 Japan Solar Energy Semiconductor electrode and method of forming same
JPS5514550B2 (de) * 1976-12-29 1980-04-17
JPS54179075U (de) * 1978-06-07 1979-12-18
JPS57172777A (en) * 1981-04-15 1982-10-23 Nippon Sheet Glass Co Ltd Modularization of photocell
JPS58190050A (ja) * 1982-04-30 1983-11-05 Nec Home Electronics Ltd ダイオ−ド組立方法
JPH0473308B2 (de) * 1983-05-17 1992-11-20 Canon Kk
JPS59211286A (ja) * 1983-05-17 1984-11-30 Canon Inc 太陽電池ユニツト
JPS604270A (ja) * 1983-06-22 1985-01-10 Hitachi Ltd 太陽電池の製造方法
JPH0554275B2 (de) * 1983-06-22 1993-08-12 Hitachi Ltd
JPS60107872A (ja) * 1983-11-16 1985-06-13 Kanegafuchi Chem Ind Co Ltd 光起電力装置
JPS6182485A (ja) * 1984-09-29 1986-04-26 Toshiba Corp 太陽電池パネル
JPH01121959U (de) * 1988-02-10 1989-08-18
JP2004200515A (ja) * 2002-12-19 2004-07-15 Kyocera Corp 太陽電池モジュール
JP2004247402A (ja) * 2003-02-12 2004-09-02 Sanyo Electric Co Ltd 太陽電池モジュールおよびその製造方法
JP2008508673A (ja) * 2004-07-27 2008-03-21 ケンブリッジ ディスプレイ テクノロジー リミテッド 有機光−電子装置用積層相互接続
US8993364B2 (en) 2009-02-02 2015-03-31 Hanergy Hi-Tech Power (Hk) Limited Integrated thin film solar cell interconnection
US9236513B2 (en) 2009-02-02 2016-01-12 Hanergy Hi-Tech Power (Hk) Limited Integrated thin film solar cell interconnection
US9385254B2 (en) 2012-04-17 2016-07-05 Hanergy Hi-Tech Power (Hk) Limited Integrated thin film solar cell interconnection
JP2014075430A (ja) * 2012-10-03 2014-04-24 Sharp Corp 太陽電池モジュール
US9362433B2 (en) 2013-01-28 2016-06-07 Hanergy Hi-Tech Power (Hk) Limited Photovoltaic interconnect systems, devices, and methods
DE102013219526B4 (de) 2013-09-27 2022-10-13 Meyer Burger (Germany) Gmbh Solarzellenverbund mit Verbindungselement und Verfahren zum Herstellen eines Solarzellenverbunds
JP2019208015A (ja) * 2018-03-28 2019-12-05 ザ・ボーイング・カンパニーＴｈｅＢｏｅｉｎｇ Ｃｏｍｐａｎｙ 剛性パネルソーラーアレイのための配線

Also Published As

Publication number Publication date
JPS5628383B2 (de) 1981-07-01

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