JPS51104261A - - Google Patents
Info
- Publication number
- JPS51104261A JPS51104261A JP50029843A JP2984375A JPS51104261A JP S51104261 A JPS51104261 A JP S51104261A JP 50029843 A JP50029843 A JP 50029843A JP 2984375 A JP2984375 A JP 2984375A JP S51104261 A JPS51104261 A JP S51104261A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50029843A JPS51104261A (ru) | 1975-03-12 | 1975-03-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50029843A JPS51104261A (ru) | 1975-03-12 | 1975-03-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS51104261A true JPS51104261A (ru) | 1976-09-14 |
Family
ID=12287274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50029843A Pending JPS51104261A (ru) | 1975-03-12 | 1975-03-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51104261A (ru) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61242041A (ja) * | 1985-04-19 | 1986-10-28 | Citizen Watch Co Ltd | 半導体装置 |
| JPH01232735A (ja) * | 1988-03-11 | 1989-09-18 | Matsushita Electric Ind Co Ltd | 半導体装置の実装体 |
-
1975
- 1975-03-12 JP JP50029843A patent/JPS51104261A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61242041A (ja) * | 1985-04-19 | 1986-10-28 | Citizen Watch Co Ltd | 半導体装置 |
| JPH01232735A (ja) * | 1988-03-11 | 1989-09-18 | Matsushita Electric Ind Co Ltd | 半導体装置の実装体 |