JPS5110368A - Purintohaisenboodonoseizohoho - Google Patents

Purintohaisenboodonoseizohoho

Info

Publication number
JPS5110368A
JPS5110368A JP4572375A JP4572375A JPS5110368A JP S5110368 A JPS5110368 A JP S5110368A JP 4572375 A JP4572375 A JP 4572375A JP 4572375 A JP4572375 A JP 4572375A JP S5110368 A JPS5110368 A JP S5110368A
Authority
JP
Japan
Prior art keywords
purintohaisenboodonoseizohoho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4572375A
Other languages
English (en)
Inventor
Reorii Hanni Suchiibun
Buruusu Jonson Dadorei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/461,072 external-priority patent/US3934334A/en
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of JPS5110368A publication Critical patent/JPS5110368A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/105—Using an electrical field; Special methods of applying an electric potential
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1355—Powder coating of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP4572375A 1974-04-15 1975-04-15 Purintohaisenboodonoseizohoho Pending JPS5110368A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US05/461,072 US3934334A (en) 1974-04-15 1974-04-15 Method of fabricating metal printed wiring boards
US50953074A 1974-09-26 1974-09-26

Publications (1)

Publication Number Publication Date
JPS5110368A true JPS5110368A (ja) 1976-01-27

Family

ID=27039908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4572375A Pending JPS5110368A (ja) 1974-04-15 1975-04-15 Purintohaisenboodonoseizohoho

Country Status (2)

Country Link
JP (1) JPS5110368A (ja)
DE (1) DE2515875A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5792893A (en) * 1980-12-01 1982-06-09 Sanyo Electric Co Method of producing large quantity of hybrid ingetrated circuit
JP2008519468A (ja) * 2004-11-11 2008-06-05 ピーピージー インダストリーズ オハイオ， インコーポレイテッド 改良されたバイアデザインを有する単層または多層プリント回路基板
WO2011093504A1 (ja) * 2010-02-01 2011-08-04 古河電気工業株式会社 車載電気接続箱用メタルコア基板
JP2011159775A (ja) * 2010-02-01 2011-08-18 Furukawa Electric Co Ltd:The 車載電気接続箱用メタルコア基板
JP2011159776A (ja) * 2010-02-01 2011-08-18 Furukawa Electric Co Ltd:The 車載電気接続箱用メタルコア基板及びこれのコア板構造
JP2011159778A (ja) * 2010-02-01 2011-08-18 Furukawa Electric Co Ltd:The 車載電気接続箱用メタルコア基板のコア板構造及びメタルコア基板
JP2011159777A (ja) * 2010-02-01 2011-08-18 Furukawa Electric Co Ltd:The 車載電気接続箱用メタルコア基板のコア板構造及びメタルコア基板

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4107837A (en) * 1977-04-07 1978-08-22 Western Electric Company, Inc. Method of fabricating a printed circuit board
EP0549791B1 (de) * 1991-04-01 1997-07-16 Aktsionernoe obschestvo otkrytogo tipa VNIIETO Mehrlagenleiterplatte und verfahren zu ihrer herstellung

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5792893A (en) * 1980-12-01 1982-06-09 Sanyo Electric Co Method of producing large quantity of hybrid ingetrated circuit
JPH0152916B2 (ja) * 1980-12-01 1989-11-10 Sanyo Electric Co
JP2008519468A (ja) * 2004-11-11 2008-06-05 ピーピージー インダストリーズ オハイオ， インコーポレイテッド 改良されたバイアデザインを有する単層または多層プリント回路基板
WO2011093504A1 (ja) * 2010-02-01 2011-08-04 古河電気工業株式会社 車載電気接続箱用メタルコア基板
JP2011159775A (ja) * 2010-02-01 2011-08-18 Furukawa Electric Co Ltd:The 車載電気接続箱用メタルコア基板
JP2011159776A (ja) * 2010-02-01 2011-08-18 Furukawa Electric Co Ltd:The 車載電気接続箱用メタルコア基板及びこれのコア板構造
JP2011159778A (ja) * 2010-02-01 2011-08-18 Furukawa Electric Co Ltd:The 車載電気接続箱用メタルコア基板のコア板構造及びメタルコア基板
JP2011159777A (ja) * 2010-02-01 2011-08-18 Furukawa Electric Co Ltd:The 車載電気接続箱用メタルコア基板のコア板構造及びメタルコア基板
CN102726126A (zh) * 2010-02-01 2012-10-10 古河电气工业株式会社 车载电气连接箱用金属芯基板

Also Published As

Publication number Publication date
DE2515875A1 (de) 1975-10-23

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