JPS51102466A - HANDOTAISOSHINOJITSUSOHOHO - Google Patents

HANDOTAISOSHINOJITSUSOHOHO

Info

Publication number
JPS51102466A
JPS51102466A JP2785975A JP2785975A JPS51102466A JP S51102466 A JPS51102466 A JP S51102466A JP 2785975 A JP2785975 A JP 2785975A JP 2785975 A JP2785975 A JP 2785975A JP S51102466 A JPS51102466 A JP S51102466A
Authority
JP
Japan
Prior art keywords
handotaisoshinojitsusohoho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2785975A
Other languages
Japanese (ja)
Inventor
Koichi Oguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suwa Seikosha KK
Original Assignee
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suwa Seikosha KK filed Critical Suwa Seikosha KK
Priority to JP2785975A priority Critical patent/JPS51102466A/en
Publication of JPS51102466A publication Critical patent/JPS51102466A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81192—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP2785975A 1975-03-06 1975-03-06 HANDOTAISOSHINOJITSUSOHOHO Pending JPS51102466A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2785975A JPS51102466A (en) 1975-03-06 1975-03-06 HANDOTAISOSHINOJITSUSOHOHO

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2785975A JPS51102466A (en) 1975-03-06 1975-03-06 HANDOTAISOSHINOJITSUSOHOHO

Publications (1)

Publication Number Publication Date
JPS51102466A true JPS51102466A (en) 1976-09-09

Family

ID=12232627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2785975A Pending JPS51102466A (en) 1975-03-06 1975-03-06 HANDOTAISOSHINOJITSUSOHOHO

Country Status (1)

Country Link
JP (1) JPS51102466A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5650539A (en) * 1979-09-29 1981-05-07 Sharp Corp Semiconductor device
JPS61259533A (en) * 1985-05-13 1986-11-17 Mitsubishi Electric Corp Semiconductor device
JPS63160352A (en) * 1986-12-24 1988-07-04 Semiconductor Energy Lab Co Ltd Method for packaging semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5650539A (en) * 1979-09-29 1981-05-07 Sharp Corp Semiconductor device
JPS61259533A (en) * 1985-05-13 1986-11-17 Mitsubishi Electric Corp Semiconductor device
JPS63160352A (en) * 1986-12-24 1988-07-04 Semiconductor Energy Lab Co Ltd Method for packaging semiconductor device
JPH0432541B2 (en) * 1986-12-24 1992-05-29
US7288437B2 (en) 1986-12-24 2007-10-30 Semiconductor Energy Laboratory Co., Ltd. Conductive pattern producing method and its applications

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