JPS5099075A - - Google Patents
Info
- Publication number
- JPS5099075A JPS5099075A JP22074A JP22074A JPS5099075A JP S5099075 A JPS5099075 A JP S5099075A JP 22074 A JP22074 A JP 22074A JP 22074 A JP22074 A JP 22074A JP S5099075 A JPS5099075 A JP S5099075A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22074A JPS5099075A (ja) | 1973-12-28 | 1973-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22074A JPS5099075A (ja) | 1973-12-28 | 1973-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5099075A true JPS5099075A (ja) | 1975-08-06 |
Family
ID=11467867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22074A Pending JPS5099075A (ja) | 1973-12-28 | 1973-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5099075A (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5445569A (en) * | 1977-09-17 | 1979-04-10 | Nec Home Electronics Ltd | Manufacture for semiconductor device |
| JPS6042846A (ja) * | 1983-08-18 | 1985-03-07 | Nec Kansai Ltd | 半導体ウエ−ハダイシング方法 |
| JPS6055640A (ja) * | 1983-09-07 | 1985-03-30 | Sanyo Electric Co Ltd | 化合物半導体基板の分割方法 |
-
1973
- 1973-12-28 JP JP22074A patent/JPS5099075A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5445569A (en) * | 1977-09-17 | 1979-04-10 | Nec Home Electronics Ltd | Manufacture for semiconductor device |
| JPS6042846A (ja) * | 1983-08-18 | 1985-03-07 | Nec Kansai Ltd | 半導体ウエ−ハダイシング方法 |
| JPS6055640A (ja) * | 1983-09-07 | 1985-03-30 | Sanyo Electric Co Ltd | 化合物半導体基板の分割方法 |