JPS5098275A - - Google Patents
Info
- Publication number
- JPS5098275A JPS5098275A JP360674A JP360674A JPS5098275A JP S5098275 A JPS5098275 A JP S5098275A JP 360674 A JP360674 A JP 360674A JP 360674 A JP360674 A JP 360674A JP S5098275 A JPS5098275 A JP S5098275A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP360674A JPS5098275A (en) | 1973-12-26 | 1973-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP360674A JPS5098275A (en) | 1973-12-26 | 1973-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5098275A true JPS5098275A (en) | 1975-08-05 |
Family
ID=11562136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP360674A Pending JPS5098275A (en) | 1973-12-26 | 1973-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5098275A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS595650A (en) * | 1982-06-25 | 1984-01-12 | アメリカ合衆国 | Airtight sealing package for hybrid solid state electronic device or the like |
| JPS60115248A (en) * | 1983-10-21 | 1985-06-21 | Daiichi Seikou Kk | Hermetic sealed semiconductor device and preparation thereof |
| JPS60163749U (en) * | 1979-08-30 | 1985-10-30 | バアー‐ブラウン リサーチ コーポレーシヨン | Molded dual inline package cage |
| JPS60242646A (en) * | 1985-05-07 | 1985-12-02 | Hitachi Ltd | Semiconductor device |
-
1973
- 1973-12-26 JP JP360674A patent/JPS5098275A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60163749U (en) * | 1979-08-30 | 1985-10-30 | バアー‐ブラウン リサーチ コーポレーシヨン | Molded dual inline package cage |
| JPS595650A (en) * | 1982-06-25 | 1984-01-12 | アメリカ合衆国 | Airtight sealing package for hybrid solid state electronic device or the like |
| JPS6220700B2 (en) * | 1982-06-25 | 1987-05-08 | Us Energy | |
| JPS60115248A (en) * | 1983-10-21 | 1985-06-21 | Daiichi Seikou Kk | Hermetic sealed semiconductor device and preparation thereof |
| JPS60242646A (en) * | 1985-05-07 | 1985-12-02 | Hitachi Ltd | Semiconductor device |