JPS509383B2 - - Google Patents

Info

Publication number
JPS509383B2
JPS509383B2 JP5968971A JP5968971A JPS509383B2 JP S509383 B2 JPS509383 B2 JP S509383B2 JP 5968971 A JP5968971 A JP 5968971A JP 5968971 A JP5968971 A JP 5968971A JP S509383 B2 JPS509383 B2 JP S509383B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5968971A
Other languages
Japanese (ja)
Other versions
JPS4826368A (pt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5968971A priority Critical patent/JPS509383B2/ja
Priority to GB3613572A priority patent/GB1331028A/en
Priority to FR7228210A priority patent/FR2148480B1/fr
Priority to CA148,789A priority patent/CA970079A/en
Priority to DE2238569A priority patent/DE2238569C3/de
Publication of JPS4826368A publication Critical patent/JPS4826368A/ja
Priority to US443670A priority patent/US3879837A/en
Publication of JPS509383B2 publication Critical patent/JPS509383B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP5968971A 1971-08-07 1971-08-07 Expired JPS509383B2 (pt)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP5968971A JPS509383B2 (pt) 1971-08-07 1971-08-07
GB3613572A GB1331028A (en) 1971-08-07 1972-08-02 Method of soldering a semiconductor plate
FR7228210A FR2148480B1 (pt) 1971-08-07 1972-08-04
CA148,789A CA970079A (en) 1971-08-07 1972-08-04 Method of soldering a semiconductor plate
DE2238569A DE2238569C3 (de) 1971-08-07 1972-08-04 Verfahren zum Löten einer Halbleiterplatte
US443670A US3879837A (en) 1971-08-07 1974-02-19 Method of soldering a semiconductor plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5968971A JPS509383B2 (pt) 1971-08-07 1971-08-07

Publications (2)

Publication Number Publication Date
JPS4826368A JPS4826368A (pt) 1973-04-06
JPS509383B2 true JPS509383B2 (pt) 1975-04-12

Family

ID=13120415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5968971A Expired JPS509383B2 (pt) 1971-08-07 1971-08-07

Country Status (1)

Country Link
JP (1) JPS509383B2 (pt)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52163478U (pt) * 1976-06-05 1977-12-10
JPS5619258B2 (pt) * 1975-09-17 1981-05-06

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5247252B2 (pt) * 1972-09-25 1977-12-01
JPS555403B2 (pt) * 1974-04-23 1980-02-06
JPS5153516A (ja) * 1974-11-06 1976-05-12 Kubota Ltd Garasusenikyokasementoseikeihinno seizohoho
JPS5227359A (en) * 1975-08-27 1977-03-01 Hitachi Ltd Face down bonding method
JPS5278233A (en) * 1975-12-25 1977-07-01 Okura Industrial Co Ltd Production of inorganic* reinforced* lighttweight combined board by extrusion
JPS5278916A (en) * 1975-12-25 1977-07-02 Nippon Sheet Glass Co Ltd Method of molding glass fiber reinforced cement products
JPS53149762A (en) * 1977-06-02 1978-12-27 Hitachi Ltd Adhering method for thin plate
JPS5547765U (pt) * 1978-09-21 1980-03-28
JPS5549520U (pt) * 1978-09-26 1980-03-31
JPS58224711A (ja) * 1982-06-23 1983-12-27 住友金属工業株式会社 セメント積層板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619258B2 (pt) * 1975-09-17 1981-05-06
JPS52163478U (pt) * 1976-06-05 1977-12-10

Also Published As

Publication number Publication date
JPS4826368A (pt) 1973-04-06

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