JPS5093586A - - Google Patents

Info

Publication number
JPS5093586A
JPS5093586A JP14315173A JP14315173A JPS5093586A JP S5093586 A JPS5093586 A JP S5093586A JP 14315173 A JP14315173 A JP 14315173A JP 14315173 A JP14315173 A JP 14315173A JP S5093586 A JPS5093586 A JP S5093586A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14315173A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14315173A priority Critical patent/JPS5093586A/ja
Publication of JPS5093586A publication Critical patent/JPS5093586A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/879—Bump connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP14315173A 1973-12-19 1973-12-19 Pending JPS5093586A (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14315173A JPS5093586A (enExample) 1973-12-19 1973-12-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14315173A JPS5093586A (enExample) 1973-12-19 1973-12-19

Publications (1)

Publication Number Publication Date
JPS5093586A true JPS5093586A (enExample) 1975-07-25

Family

ID=15332101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14315173A Pending JPS5093586A (enExample) 1973-12-19 1973-12-19

Country Status (1)

Country Link
JP (1) JPS5093586A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5731185A (en) * 1980-07-31 1982-02-19 Matsushita Electric Ind Co Ltd Light-emitting device
JPS5735369A (en) * 1980-08-11 1982-02-25 Mitsubishi Electric Corp Semiconductor device
JPS63142861A (ja) * 1986-12-05 1988-06-15 Matsushita Electric Ind Co Ltd 半導体集積回路
JPS63107483U (enExample) * 1986-12-29 1988-07-11
JPH01129456A (ja) * 1987-11-16 1989-05-22 Mitsubishi Electric Corp 光電子集積回路
JPH0341769A (ja) * 1989-07-07 1991-02-22 Nippon Telegr & Teleph Corp <Ntt> 光電子集積回路及びその製法
JPH07254694A (ja) * 1994-10-26 1995-10-03 Toshiba Corp 半導体装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5731185A (en) * 1980-07-31 1982-02-19 Matsushita Electric Ind Co Ltd Light-emitting device
JPS5735369A (en) * 1980-08-11 1982-02-25 Mitsubishi Electric Corp Semiconductor device
JPS63142861A (ja) * 1986-12-05 1988-06-15 Matsushita Electric Ind Co Ltd 半導体集積回路
JPS63107483U (enExample) * 1986-12-29 1988-07-11
JPH01129456A (ja) * 1987-11-16 1989-05-22 Mitsubishi Electric Corp 光電子集積回路
JPH0341769A (ja) * 1989-07-07 1991-02-22 Nippon Telegr & Teleph Corp <Ntt> 光電子集積回路及びその製法
JPH07254694A (ja) * 1994-10-26 1995-10-03 Toshiba Corp 半導体装置

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