JPS509267A - - Google Patents
Info
- Publication number
- JPS509267A JPS509267A JP5985573A JP5985573A JPS509267A JP S509267 A JPS509267 A JP S509267A JP 5985573 A JP5985573 A JP 5985573A JP 5985573 A JP5985573 A JP 5985573A JP S509267 A JPS509267 A JP S509267A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5985573A JPS509267A (tr) | 1973-05-30 | 1973-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5985573A JPS509267A (tr) | 1973-05-30 | 1973-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS509267A true JPS509267A (tr) | 1975-01-30 |
Family
ID=13125209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5985573A Pending JPS509267A (tr) | 1973-05-30 | 1973-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS509267A (tr) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53102670A (en) * | 1977-02-21 | 1978-09-07 | Hitachi Ltd | Lead bending method for glass ceramic package type semiconductor device |
| JPS5840845U (ja) * | 1981-09-11 | 1983-03-17 | 有限会社ティ・アンド・ケイ・インターナショナル研究所 | 半導体成形品におけるリ−ド折曲装置 |
| JPS60121754A (ja) * | 1984-11-12 | 1985-06-29 | Hitachi Ltd | リードの折り曲げ装置 |
| JPS6182451A (ja) * | 1984-09-29 | 1986-04-26 | Fujitsu Autom Kk | Ｉｃパツケ−ジのリ−ド曲げ加工方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS494057U (tr) * | 1972-04-20 | 1974-01-14 |
-
1973
- 1973-05-30 JP JP5985573A patent/JPS509267A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS494057U (tr) * | 1972-04-20 | 1974-01-14 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53102670A (en) * | 1977-02-21 | 1978-09-07 | Hitachi Ltd | Lead bending method for glass ceramic package type semiconductor device |
| JPS5840845U (ja) * | 1981-09-11 | 1983-03-17 | 有限会社ティ・アンド・ケイ・インターナショナル研究所 | 半導体成形品におけるリ−ド折曲装置 |
| JPS6331408Y2 (tr) * | 1981-09-11 | 1988-08-22 | ||
| JPS6182451A (ja) * | 1984-09-29 | 1986-04-26 | Fujitsu Autom Kk | Ｉｃパツケ−ジのリ−ド曲げ加工方法 |
| JPH0126177B2 (tr) * | 1984-09-29 | 1989-05-22 | Fujitsu Ootomeeshon Kk | |
| JPS60121754A (ja) * | 1984-11-12 | 1985-06-29 | Hitachi Ltd | リードの折り曲げ装置 |