JPS5087278A - - Google Patents

Info

Publication number
JPS5087278A
JPS5087278A JP48135409A JP13540973A JPS5087278A JP S5087278 A JPS5087278 A JP S5087278A JP 48135409 A JP48135409 A JP 48135409A JP 13540973 A JP13540973 A JP 13540973A JP S5087278 A JPS5087278 A JP S5087278A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48135409A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48135409A priority Critical patent/JPS5087278A/ja
Publication of JPS5087278A publication Critical patent/JPS5087278A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/012—
    • H10W72/242—
JP48135409A 1973-12-05 1973-12-05 Pending JPS5087278A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48135409A JPS5087278A (en) 1973-12-05 1973-12-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48135409A JPS5087278A (en) 1973-12-05 1973-12-05

Publications (1)

Publication Number Publication Date
JPS5087278A true JPS5087278A (en) 1975-07-14

Family

ID=15151040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48135409A Pending JPS5087278A (en) 1973-12-05 1973-12-05

Country Status (1)

Country Link
JP (1) JPS5087278A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62136049A (en) * 1985-12-10 1987-06-19 Fuji Electric Co Ltd Manufacture of semiconductor device
JPH0425026A (en) * 1990-05-16 1992-01-28 Matsushita Electron Corp Method of forming bump electrode
JP2001118876A (en) * 1999-08-12 2001-04-27 Fujitsu Ltd Semiconductor device and manufacturing method thereof
US6991965B2 (en) 2002-12-13 2006-01-31 Nec Electronics Corporation Production method for manufacturing a plurality of chip-size packages
JP2010192928A (en) * 1999-08-12 2010-09-02 Fujitsu Semiconductor Ltd Semiconductor device, and method of manufacturing the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62136049A (en) * 1985-12-10 1987-06-19 Fuji Electric Co Ltd Manufacture of semiconductor device
JPH0425026A (en) * 1990-05-16 1992-01-28 Matsushita Electron Corp Method of forming bump electrode
JP2001118876A (en) * 1999-08-12 2001-04-27 Fujitsu Ltd Semiconductor device and manufacturing method thereof
JP2010192928A (en) * 1999-08-12 2010-09-02 Fujitsu Semiconductor Ltd Semiconductor device, and method of manufacturing the same
US6991965B2 (en) 2002-12-13 2006-01-31 Nec Electronics Corporation Production method for manufacturing a plurality of chip-size packages

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