JPS5086272A - - Google Patents
Info
- Publication number
- JPS5086272A JPS5086272A JP13342373A JP13342373A JPS5086272A JP S5086272 A JPS5086272 A JP S5086272A JP 13342373 A JP13342373 A JP 13342373A JP 13342373 A JP13342373 A JP 13342373A JP S5086272 A JPS5086272 A JP S5086272A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13342373A JPS5086272A (ja) | 1973-11-30 | 1973-11-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13342373A JPS5086272A (ja) | 1973-11-30 | 1973-11-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5086272A true JPS5086272A (ja) | 1975-07-11 |
Family
ID=15104413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13342373A Pending JPS5086272A (ja) | 1973-11-30 | 1973-11-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5086272A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56146237A (en) * | 1980-04-14 | 1981-11-13 | Yokogawa Hokushin Electric Corp | Manufacture of rock crystal and silicon element |
JPS58145175A (ja) * | 1982-02-22 | 1983-08-29 | Nec Corp | 集積回路チップ搭載用基板及びその製造方法 |
JP2004053850A (ja) * | 2002-07-18 | 2004-02-19 | Fujitsu Ltd | デバイスチップの製造方法 |
-
1973
- 1973-11-30 JP JP13342373A patent/JPS5086272A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56146237A (en) * | 1980-04-14 | 1981-11-13 | Yokogawa Hokushin Electric Corp | Manufacture of rock crystal and silicon element |
JPS58145175A (ja) * | 1982-02-22 | 1983-08-29 | Nec Corp | 集積回路チップ搭載用基板及びその製造方法 |
JP2004053850A (ja) * | 2002-07-18 | 2004-02-19 | Fujitsu Ltd | デバイスチップの製造方法 |