JPS5074534A - - Google Patents

Info

Publication number
JPS5074534A
JPS5074534A JP49124203A JP12420374A JPS5074534A JP S5074534 A JPS5074534 A JP S5074534A JP 49124203 A JP49124203 A JP 49124203A JP 12420374 A JP12420374 A JP 12420374A JP S5074534 A JPS5074534 A JP S5074534A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49124203A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5074534A publication Critical patent/JPS5074534A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/16—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation by cathodic sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP49124203A 1973-10-27 1974-10-28 Pending JPS5074534A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19732353942 DE2353942A1 (de) 1973-10-27 1973-10-27 Verfahren zur herstellung einer loetfesten kupferschicht

Publications (1)

Publication Number Publication Date
JPS5074534A true JPS5074534A (ja) 1975-06-19

Family

ID=5896616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49124203A Pending JPS5074534A (ja) 1973-10-27 1974-10-28

Country Status (7)

Country Link
US (1) US3930975A (ja)
JP (1) JPS5074534A (ja)
BE (1) BE821512A (ja)
DE (1) DE2353942A1 (ja)
FR (1) FR2249410B1 (ja)
GB (1) GB1483265A (ja)
NL (1) NL7413996A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5956971A (ja) * 1982-09-27 1984-04-02 Tanaka Kikinzoku Kogyo Kk スパツタリング用タ−ゲツトの製造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4288306A (en) * 1978-07-08 1981-09-08 Wolfgang Kieferle Process for forming a metal or alloy layer and device for executing same
GB2131624B (en) * 1982-12-09 1986-07-09 Standard Telephones Cables Ltd Thick film circuits
GB2139248A (en) * 1983-05-04 1984-11-07 Gen Electric Co Plc Copper alloy solderable contact pad produced by vapour deposition
US4552607A (en) * 1984-06-04 1985-11-12 Advanced Technology Laboratories, Inc. Method of making electrically conductive thin epoxy bond
US4670339A (en) * 1984-06-04 1987-06-02 Advanced Technology Laboratories, Inc. Electrically conductive thin epoxy bond
US5317190A (en) * 1991-10-25 1994-05-31 International Business Machines Corporation Oxygen assisted ohmic contact formation to N-type gallium arsenide
US5372848A (en) * 1992-12-24 1994-12-13 International Business Machines Corporation Process for creating organic polymeric substrate with copper
CN103143801A (zh) * 2011-12-06 2013-06-12 中国科学院电子学研究所 空间行波管收集极与辐射散热器钎焊前的表面处理方法
US9355864B2 (en) 2013-08-06 2016-05-31 Tel Nexx, Inc. Method for increasing adhesion of copper to polymeric surfaces

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE759235A (fr) * 1969-11-20 1971-05-21 Triplex Safety Glass Co Perfectionnements aux objets transparents conducteurs de l'electricite
US3766041A (en) * 1970-09-29 1973-10-16 Matsushita Electric Ind Co Ltd Method of producing piezoelectric thin films by cathodic sputtering
BE793268A (fr) * 1971-12-24 1973-06-22 Rhone Progil Procede de liaison du titane ou du tantale avec du cuivre ou dufer
US3798146A (en) * 1973-06-06 1974-03-19 Shatterproof Glass Corp Method of making a transparent article having reduced radiation transmittance

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5956971A (ja) * 1982-09-27 1984-04-02 Tanaka Kikinzoku Kogyo Kk スパツタリング用タ−ゲツトの製造方法
JPH0140711B2 (ja) * 1982-09-27 1989-08-30 Tanaka Precious Metal Ind

Also Published As

Publication number Publication date
BE821512A (fr) 1975-02-17
FR2249410B1 (ja) 1978-10-13
US3930975A (en) 1976-01-06
FR2249410A1 (ja) 1975-05-23
NL7413996A (nl) 1975-04-29
GB1483265A (en) 1977-08-17
DE2353942A1 (de) 1975-05-07

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