JPS5072930A - - Google Patents
Info
- Publication number
- JPS5072930A JPS5072930A JP12073673A JP12073673A JPS5072930A JP S5072930 A JPS5072930 A JP S5072930A JP 12073673 A JP12073673 A JP 12073673A JP 12073673 A JP12073673 A JP 12073673A JP S5072930 A JPS5072930 A JP S5072930A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12073673A JPS5336861B2 (en) | 1973-10-29 | 1973-10-29 | |
CA193,147A CA1035889A (en) | 1973-10-13 | 1974-02-21 | Flexible adhesive composition and method for utilizing same |
US05/444,263 US3932689A (en) | 1973-10-13 | 1974-02-21 | Flexible adhesive composition and method for utilizing same and article formed therefrom |
AU66020/74A AU461550B2 (en) | 1973-10-13 | 1974-02-26 | Flexible adhesive composition and method for utilizing same |
GB927874A GB1427302A (en) | 1973-10-13 | 1974-03-01 | Adhesive composition and its use in the manufacture of flexible metal-clad laminates |
DE19742410728 DE2410728C3 (en) | 1973-10-13 | 1974-03-06 | Adhesive for flexible printed circuits and use for the production of metal-clad or metal-clad composite structures for flexible printed circuits |
FR7408017A FR2247521B1 (en) | 1973-10-13 | 1974-03-08 | |
IT4920374A IT1015840B (en) | 1973-10-13 | 1974-03-08 | METHOD OF MANUFACTURING FLEXIBLE PRINTED CIRCUITS USING THE COM ADHESIVE POSITION |
CH335974A CH619484A5 (en) | 1973-10-13 | 1974-03-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12073673A JPS5336861B2 (en) | 1973-10-29 | 1973-10-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5072930A true JPS5072930A (en) | 1975-06-16 |
JPS5336861B2 JPS5336861B2 (en) | 1978-10-05 |
Family
ID=14793701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12073673A Expired JPS5336861B2 (en) | 1973-10-13 | 1973-10-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5336861B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57131223A (en) * | 1981-02-06 | 1982-08-14 | Hitachi Ltd | Resin composition |
JPS57195727A (en) * | 1981-05-29 | 1982-12-01 | Hitachi Ltd | Epoxy resin composition |
JPS6386780A (en) * | 1986-09-30 | 1988-04-18 | Hitachi Chem Co Ltd | Production of copper foil adhesive for copper-clad laminate |
JP2001139669A (en) * | 1999-11-10 | 2001-05-22 | Jsr Corp | Hardener, thermosetting resin composition and its cured product |
JP2018053074A (en) * | 2016-09-28 | 2018-04-05 | 住友ベークライト株式会社 | Resin composition for composite material and molding |
JP2018115249A (en) * | 2017-01-17 | 2018-07-26 | 住友ベークライト株式会社 | Resin composition, photosensitive resin composition, resin film and electronic device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5065873A (en) * | 1973-10-13 | 1975-06-03 |
-
1973
- 1973-10-29 JP JP12073673A patent/JPS5336861B2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5065873A (en) * | 1973-10-13 | 1975-06-03 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57131223A (en) * | 1981-02-06 | 1982-08-14 | Hitachi Ltd | Resin composition |
JPS57195727A (en) * | 1981-05-29 | 1982-12-01 | Hitachi Ltd | Epoxy resin composition |
JPS6386780A (en) * | 1986-09-30 | 1988-04-18 | Hitachi Chem Co Ltd | Production of copper foil adhesive for copper-clad laminate |
JP2001139669A (en) * | 1999-11-10 | 2001-05-22 | Jsr Corp | Hardener, thermosetting resin composition and its cured product |
JP2018053074A (en) * | 2016-09-28 | 2018-04-05 | 住友ベークライト株式会社 | Resin composition for composite material and molding |
JP2018115249A (en) * | 2017-01-17 | 2018-07-26 | 住友ベークライト株式会社 | Resin composition, photosensitive resin composition, resin film and electronic device |
Also Published As
Publication number | Publication date |
---|---|
JPS5336861B2 (en) | 1978-10-05 |