JPS5065873A - - Google Patents
Info
- Publication number
- JPS5065873A JPS5065873A JP11435373A JP11435373A JPS5065873A JP S5065873 A JPS5065873 A JP S5065873A JP 11435373 A JP11435373 A JP 11435373A JP 11435373 A JP11435373 A JP 11435373A JP S5065873 A JPS5065873 A JP S5065873A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Insulating Bodies (AREA)
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11435373A JPS5065873A (en) | 1973-10-13 | 1973-10-13 | |
CA193,147A CA1035889A (en) | 1973-10-13 | 1974-02-21 | Flexible adhesive composition and method for utilizing same |
US05/444,263 US3932689A (en) | 1973-10-13 | 1974-02-21 | Flexible adhesive composition and method for utilizing same and article formed therefrom |
AU66020/74A AU461550B2 (en) | 1973-10-13 | 1974-02-26 | Flexible adhesive composition and method for utilizing same |
GB927874A GB1427302A (en) | 1973-10-13 | 1974-03-01 | Adhesive composition and its use in the manufacture of flexible metal-clad laminates |
DE19742410728 DE2410728C3 (en) | 1973-10-13 | 1974-03-06 | Adhesive for flexible printed circuits and use for the production of metal-clad or metal-clad composite structures for flexible printed circuits |
FR7408017A FR2247521B1 (en) | 1973-10-13 | 1974-03-08 | |
IT4920374A IT1015840B (en) | 1973-10-13 | 1974-03-08 | METHOD OF MANUFACTURING FLEXIBLE PRINTED CIRCUITS USING THE COM ADHESIVE POSITION |
SU742005879A SU651712A3 (en) | 1973-10-13 | 1974-03-09 | Adhesive for flexible printing plates |
CH335974A CH619484A5 (en) | 1973-10-13 | 1974-03-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11435373A JPS5065873A (en) | 1973-10-13 | 1973-10-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5065873A true JPS5065873A (en) | 1975-06-03 |
Family
ID=14635607
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11435373A Pending JPS5065873A (en) | 1973-10-13 | 1973-10-13 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS5065873A (en) |
SU (1) | SU651712A3 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5072930A (en) * | 1973-10-29 | 1975-06-16 | ||
WO2017208555A1 (en) * | 2016-05-30 | 2017-12-07 | 協立化学産業株式会社 | Epoxy resin, fully modified epoxy resin, and curable composition including same |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2741435C2 (en) * | 2016-08-12 | 2021-01-26 | Дау Глоубл Текнолоджиз Ллк | Pressure-sensitive water-based adhesive compositions and methods for production thereof |
JP6924255B2 (en) | 2016-08-12 | 2021-08-25 | ダウ グローバル テクノロジーズ エルエルシー | Aqueous pressure-sensitive adhesive composition and its manufacturing method |
-
1973
- 1973-10-13 JP JP11435373A patent/JPS5065873A/ja active Pending
-
1974
- 1974-03-09 SU SU742005879A patent/SU651712A3/en active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5072930A (en) * | 1973-10-29 | 1975-06-16 | ||
JPS5336861B2 (en) * | 1973-10-29 | 1978-10-05 | ||
WO2017208555A1 (en) * | 2016-05-30 | 2017-12-07 | 協立化学産業株式会社 | Epoxy resin, fully modified epoxy resin, and curable composition including same |
JP2017214462A (en) * | 2016-05-30 | 2017-12-07 | 協立化学産業株式会社 | Epoxy resin, completely modified epoxy resin and curable composition containing the same |
Also Published As
Publication number | Publication date |
---|---|
SU651712A3 (en) | 1979-03-05 |