JPS5067562A - - Google Patents
Info
- Publication number
- JPS5067562A JPS5067562A JP48114785A JP11478573A JPS5067562A JP S5067562 A JPS5067562 A JP S5067562A JP 48114785 A JP48114785 A JP 48114785A JP 11478573 A JP11478573 A JP 11478573A JP S5067562 A JPS5067562 A JP S5067562A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP48114785A JPS5067562A (ja) | 1973-10-15 | 1973-10-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP48114785A JPS5067562A (ja) | 1973-10-15 | 1973-10-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5067562A true JPS5067562A (ja) | 1975-06-06 |
Family
ID=14646610
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP48114785A Pending JPS5067562A (ja) | 1973-10-15 | 1973-10-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5067562A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51117574A (en) * | 1975-04-08 | 1976-10-15 | Seiko Epson Corp | Semiconductor equipment |
JPS5238884A (en) * | 1975-09-23 | 1977-03-25 | Mitsubishi Electric Corp | Method of forming bump of flip chips |
-
1973
- 1973-10-15 JP JP48114785A patent/JPS5067562A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51117574A (en) * | 1975-04-08 | 1976-10-15 | Seiko Epson Corp | Semiconductor equipment |
JPS5826175B2 (ja) * | 1975-04-08 | 1983-06-01 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
JPS5238884A (en) * | 1975-09-23 | 1977-03-25 | Mitsubishi Electric Corp | Method of forming bump of flip chips |