JPS5067237A - - Google Patents

Info

Publication number
JPS5067237A
JPS5067237A JP49119839A JP11983974A JPS5067237A JP S5067237 A JPS5067237 A JP S5067237A JP 49119839 A JP49119839 A JP 49119839A JP 11983974 A JP11983974 A JP 11983974A JP S5067237 A JPS5067237 A JP S5067237A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49119839A
Other languages
Japanese (ja)
Other versions
JPS5428142B2 (cg-RX-API-DMAC10.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5067237A publication Critical patent/JPS5067237A/ja
Publication of JPS5428142B2 publication Critical patent/JPS5428142B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP11983974A 1973-10-18 1974-10-16 Expired JPS5428142B2 (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE7314211A SE390986B (sv) 1973-10-18 1973-10-18 Forfarande for elektropletering aw beleggningar av tenn eller tenn- blylegerinh ur ett surt elektrolytbad

Publications (2)

Publication Number Publication Date
JPS5067237A true JPS5067237A (cg-RX-API-DMAC10.html) 1975-06-05
JPS5428142B2 JPS5428142B2 (cg-RX-API-DMAC10.html) 1979-09-14

Family

ID=20318865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11983974A Expired JPS5428142B2 (cg-RX-API-DMAC10.html) 1973-10-18 1974-10-16

Country Status (7)

Country Link
US (1) US3954573A (cg-RX-API-DMAC10.html)
JP (1) JPS5428142B2 (cg-RX-API-DMAC10.html)
CA (1) CA1031718A (cg-RX-API-DMAC10.html)
FR (1) FR2248337B1 (cg-RX-API-DMAC10.html)
GB (1) GB1442890A (cg-RX-API-DMAC10.html)
NL (1) NL160886C (cg-RX-API-DMAC10.html)
SE (1) SE390986B (cg-RX-API-DMAC10.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1552263A (en) * 1977-03-04 1979-09-12 Bnf Metals Tech Centre Trivalent chromium plating baths
US4135991A (en) * 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead
JPS5818996B2 (ja) * 1980-02-21 1983-04-15 キザイ株式会社 緻密なめっき被膜を得るための中性錫電気めっき浴
SE8204505L (sv) * 1981-09-08 1983-03-09 Occidental Chem Co Elektropletering for avsettning av tenn-blylegeringar pa olika underlag
AU2927392A (en) * 1991-11-01 1993-06-07 National-Standard Company Age resistant solder coatings
CN100457977C (zh) * 2004-08-03 2009-02-04 上海新阳半导体材料有限公司 一种无铅纯锡电镀添加剂及其制备方法
US9512530B2 (en) * 2004-11-24 2016-12-06 Sumitomo Electric Industries, Ltd. Molten salt bath, deposit, and method of producing metal deposit
JP5622360B2 (ja) * 2009-01-16 2014-11-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. 電気錫めっき液および電気錫めっき方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2460252A (en) * 1946-02-09 1949-01-25 Harshaw Chem Corp Lead-tin alloy plating
US3749649A (en) * 1971-12-16 1973-07-31 M & T Chemicals Inc Bright tin-lead alloy plating
US3850765A (en) * 1973-05-21 1974-11-26 Oxy Metal Finishing Corp Bright solder plating

Also Published As

Publication number Publication date
DE2449189B2 (de) 1976-04-15
CA1031718A (en) 1978-05-23
JPS5428142B2 (cg-RX-API-DMAC10.html) 1979-09-14
NL7413615A (nl) 1975-04-22
GB1442890A (en) 1976-07-14
NL160886C (nl) 1979-12-17
SE390986B (sv) 1977-01-31
NL160886B (nl) 1979-07-16
FR2248337A1 (cg-RX-API-DMAC10.html) 1975-05-16
DE2449189A1 (de) 1975-04-24
US3954573A (en) 1976-05-04
SE7314211L (cg-RX-API-DMAC10.html) 1975-04-21
FR2248337B1 (cg-RX-API-DMAC10.html) 1982-02-26

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