JPS5061770U - - Google Patents
Info
- Publication number
- JPS5061770U JPS5061770U JP11625973U JP11625973U JPS5061770U JP S5061770 U JPS5061770 U JP S5061770U JP 11625973 U JP11625973 U JP 11625973U JP 11625973 U JP11625973 U JP 11625973U JP S5061770 U JPS5061770 U JP S5061770U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11625973U JPS5061770U (zh) | 1973-10-05 | 1973-10-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11625973U JPS5061770U (zh) | 1973-10-05 | 1973-10-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5061770U true JPS5061770U (zh) | 1975-06-06 |
Family
ID=28349948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11625973U Pending JPS5061770U (zh) | 1973-10-05 | 1973-10-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5061770U (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109994447A (zh) * | 2017-12-22 | 2019-07-09 | 三菱电机株式会社 | 半导体模块 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4826185A (zh) * | 1971-08-06 | 1973-04-05 |
-
1973
- 1973-10-05 JP JP11625973U patent/JPS5061770U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4826185A (zh) * | 1971-08-06 | 1973-04-05 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109994447A (zh) * | 2017-12-22 | 2019-07-09 | 三菱电机株式会社 | 半导体模块 |
| JP2019114640A (ja) * | 2017-12-22 | 2019-07-11 | 三菱電機株式会社 | 半導体モジュール |
| US10373899B2 (en) | 2017-12-22 | 2019-08-06 | Mitsubishi Electric Corporation | Semiconductor module using lead frame for power and control terminals and both having asymmetric or inhomogenous configuration |
| CN109994447B (zh) * | 2017-12-22 | 2023-05-12 | 三菱电机株式会社 | 半导体模块 |
| DE102018212047B4 (de) | 2017-12-22 | 2023-07-06 | Mitsubishi Electric Corporation | Halbleitermodul |