JPS5050687A - - Google Patents
Info
- Publication number
- JPS5050687A JPS5050687A JP10023773A JP10023773A JPS5050687A JP S5050687 A JPS5050687 A JP S5050687A JP 10023773 A JP10023773 A JP 10023773A JP 10023773 A JP10023773 A JP 10023773A JP S5050687 A JPS5050687 A JP S5050687A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10023773A JPS5050687A (ja) | 1973-09-07 | 1973-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10023773A JPS5050687A (ja) | 1973-09-07 | 1973-09-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5050687A true JPS5050687A (ja) | 1975-05-07 |
Family
ID=14268635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10023773A Pending JPS5050687A (ja) | 1973-09-07 | 1973-09-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5050687A (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5497542A (en) * | 1978-01-19 | 1979-08-01 | Sumitomo Electric Ind Ltd | Production of molten metal plated conductor |
| US5595934A (en) * | 1995-05-17 | 1997-01-21 | Samsung Electronics Co., Ltd. | Method for forming oxide protective film on bonding pads of semiconductor chips by UV/O3 treatment |
| JP2014145128A (ja) * | 2013-01-30 | 2014-08-14 | Yazaki Corp | 銅クロム合金線材、および、高延性高強度銅クロム合金線材の非加熱製造方法 |
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1973
- 1973-09-07 JP JP10023773A patent/JPS5050687A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5497542A (en) * | 1978-01-19 | 1979-08-01 | Sumitomo Electric Ind Ltd | Production of molten metal plated conductor |
| US5595934A (en) * | 1995-05-17 | 1997-01-21 | Samsung Electronics Co., Ltd. | Method for forming oxide protective film on bonding pads of semiconductor chips by UV/O3 treatment |
| JP2014145128A (ja) * | 2013-01-30 | 2014-08-14 | Yazaki Corp | 銅クロム合金線材、および、高延性高強度銅クロム合金線材の非加熱製造方法 |