JPS5040549Y2 - - Google Patents

Info

Publication number
JPS5040549Y2
JPS5040549Y2 JP1971114942U JP11494271U JPS5040549Y2 JP S5040549 Y2 JPS5040549 Y2 JP S5040549Y2 JP 1971114942 U JP1971114942 U JP 1971114942U JP 11494271 U JP11494271 U JP 11494271U JP S5040549 Y2 JPS5040549 Y2 JP S5040549Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1971114942U
Other languages
Japanese (ja)
Other versions
JPS4870557U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1971114942U priority Critical patent/JPS5040549Y2/ja
Publication of JPS4870557U publication Critical patent/JPS4870557U/ja
Application granted granted Critical
Publication of JPS5040549Y2 publication Critical patent/JPS5040549Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1971114942U 1971-12-07 1971-12-07 Expired JPS5040549Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1971114942U JPS5040549Y2 (enExample) 1971-12-07 1971-12-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1971114942U JPS5040549Y2 (enExample) 1971-12-07 1971-12-07

Publications (2)

Publication Number Publication Date
JPS4870557U JPS4870557U (enExample) 1973-09-05
JPS5040549Y2 true JPS5040549Y2 (enExample) 1975-11-19

Family

ID=28027125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1971114942U Expired JPS5040549Y2 (enExample) 1971-12-07 1971-12-07

Country Status (1)

Country Link
JP (1) JPS5040549Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60149137U (ja) * 1984-03-13 1985-10-03 株式会社東芝 樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPS4870557U (enExample) 1973-09-05

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