JPS4870557U - - Google Patents
Info
- Publication number
- JPS4870557U JPS4870557U JP1971114942U JP11494271U JPS4870557U JP S4870557 U JPS4870557 U JP S4870557U JP 1971114942 U JP1971114942 U JP 1971114942U JP 11494271 U JP11494271 U JP 11494271U JP S4870557 U JPS4870557 U JP S4870557U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1971114942U JPS5040549Y2 (enExample) | 1971-12-07 | 1971-12-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1971114942U JPS5040549Y2 (enExample) | 1971-12-07 | 1971-12-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4870557U true JPS4870557U (enExample) | 1973-09-05 |
| JPS5040549Y2 JPS5040549Y2 (enExample) | 1975-11-19 |
Family
ID=28027125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1971114942U Expired JPS5040549Y2 (enExample) | 1971-12-07 | 1971-12-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5040549Y2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60149137U (ja) * | 1984-03-13 | 1985-10-03 | 株式会社東芝 | 樹脂封止型半導体装置 |
-
1971
- 1971-12-07 JP JP1971114942U patent/JPS5040549Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60149137U (ja) * | 1984-03-13 | 1985-10-03 | 株式会社東芝 | 樹脂封止型半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5040549Y2 (enExample) | 1975-11-19 |