JPS5037362A - - Google Patents

Info

Publication number
JPS5037362A
JPS5037362A JP8749773A JP8749773A JPS5037362A JP S5037362 A JPS5037362 A JP S5037362A JP 8749773 A JP8749773 A JP 8749773A JP 8749773 A JP8749773 A JP 8749773A JP S5037362 A JPS5037362 A JP S5037362A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8749773A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8749773A priority Critical patent/JPS5037362A/ja
Publication of JPS5037362A publication Critical patent/JPS5037362A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP8749773A 1973-08-06 1973-08-06 Pending JPS5037362A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8749773A JPS5037362A (ja) 1973-08-06 1973-08-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8749773A JPS5037362A (ja) 1973-08-06 1973-08-06

Publications (1)

Publication Number Publication Date
JPS5037362A true JPS5037362A (ja) 1975-04-08

Family

ID=13916593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8749773A Pending JPS5037362A (ja) 1973-08-06 1973-08-06

Country Status (1)

Country Link
JP (1) JPS5037362A (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5461874A (en) * 1977-10-14 1979-05-18 Plessey Inc Punching lead frame for semiconductor package
JPS5593249A (en) * 1979-01-10 1980-07-15 Hitachi Ltd Manufacture of semiconductor device
JPS55163867A (en) * 1979-06-07 1980-12-20 Fujitsu Ltd Lead frame for semiconductor device
JPS564259A (en) * 1979-06-25 1981-01-17 Hitachi Ltd Lead frame
JPS5769246U (ja) * 1980-10-15 1982-04-26
JPS57203561U (ja) * 1981-06-22 1982-12-24
JPS5890751A (ja) * 1982-11-15 1983-05-30 Hitachi Ltd リ−ドフレ−ムの製法
JPS5890750A (ja) * 1982-11-15 1983-05-30 Hitachi Ltd リ−ドフレ−ムの製法
JPS58148947U (ja) * 1982-03-31 1983-10-06 富士通株式会社 リ−ドフレ−ム
JPS6041247A (ja) * 1984-04-25 1985-03-04 Hitachi Ltd 樹脂封止型半導体装置の製造方法
JPS6433751U (ja) * 1987-08-25 1989-03-02

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5461874A (en) * 1977-10-14 1979-05-18 Plessey Inc Punching lead frame for semiconductor package
JPS5593249A (en) * 1979-01-10 1980-07-15 Hitachi Ltd Manufacture of semiconductor device
JPS55163867A (en) * 1979-06-07 1980-12-20 Fujitsu Ltd Lead frame for semiconductor device
JPS6217383B2 (ja) * 1979-06-07 1987-04-17 Fujitsu Ltd
JPS564259A (en) * 1979-06-25 1981-01-17 Hitachi Ltd Lead frame
JPS5769246U (ja) * 1980-10-15 1982-04-26
JPS57203561U (ja) * 1981-06-22 1982-12-24
JPS58148947U (ja) * 1982-03-31 1983-10-06 富士通株式会社 リ−ドフレ−ム
JPS5890751A (ja) * 1982-11-15 1983-05-30 Hitachi Ltd リ−ドフレ−ムの製法
JPS5890750A (ja) * 1982-11-15 1983-05-30 Hitachi Ltd リ−ドフレ−ムの製法
JPS6041247A (ja) * 1984-04-25 1985-03-04 Hitachi Ltd 樹脂封止型半導体装置の製造方法
JPS6433751U (ja) * 1987-08-25 1989-03-02

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