JPS5036553A - - Google Patents

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Publication number
JPS5036553A
JPS5036553A JP48086758A JP8675873A JPS5036553A JP S5036553 A JPS5036553 A JP S5036553A JP 48086758 A JP48086758 A JP 48086758A JP 8675873 A JP8675873 A JP 8675873A JP S5036553 A JPS5036553 A JP S5036553A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48086758A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48086758A priority Critical patent/JPS5036553A/ja
Publication of JPS5036553A publication Critical patent/JPS5036553A/ja
Pending legal-status Critical Current

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  • Extrusion Moulding Of Plastics Or The Like (AREA)
JP48086758A 1973-08-03 1973-08-03 Pending JPS5036553A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48086758A JPS5036553A (ja) 1973-08-03 1973-08-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48086758A JPS5036553A (ja) 1973-08-03 1973-08-03

Publications (1)

Publication Number Publication Date
JPS5036553A true JPS5036553A (ja) 1975-04-05

Family

ID=13895639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48086758A Pending JPS5036553A (ja) 1973-08-03 1973-08-03

Country Status (1)

Country Link
JP (1) JPS5036553A (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5240979A (en) * 1975-09-26 1977-03-30 Nec Corp Apparatus for testing characteristics of semiconductor device
JPS53768U (ja) * 1976-06-22 1978-01-06
JPS5389676A (en) * 1977-01-19 1978-08-07 Hitachi Ltd Extracting method for non-defective or defective semiconductor pelletsbased on memory means
JPS5818936A (ja) * 1981-07-27 1983-02-03 Toshiba Corp 半導体素子の選別方式
JPS5897844A (ja) * 1981-12-07 1983-06-10 Shinkawa Ltd ダイ詰め換え装置
JPS6192824A (ja) * 1984-07-10 1986-05-10 サン−ゴバン ビトラ−ジユ プラスチック材料を準備する装置
JP2005508265A (ja) * 2001-11-02 2005-03-31 アール.ピー. シェーラー テクノロジーズ インコーポレイテッド カプセル製品を製造する装置および方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5240979A (en) * 1975-09-26 1977-03-30 Nec Corp Apparatus for testing characteristics of semiconductor device
JPS608625B2 (ja) * 1975-09-26 1985-03-04 日本電気株式会社 半導体装置の特性試験装置
JPS53768U (ja) * 1976-06-22 1978-01-06
JPS5389676A (en) * 1977-01-19 1978-08-07 Hitachi Ltd Extracting method for non-defective or defective semiconductor pelletsbased on memory means
JPS5410832B2 (ja) * 1977-01-19 1979-05-10
JPS5818936A (ja) * 1981-07-27 1983-02-03 Toshiba Corp 半導体素子の選別方式
JPS5897844A (ja) * 1981-12-07 1983-06-10 Shinkawa Ltd ダイ詰め換え装置
JPS6262053B2 (ja) * 1981-12-07 1987-12-24 Shinkawa Kk
JPS6192824A (ja) * 1984-07-10 1986-05-10 サン−ゴバン ビトラ−ジユ プラスチック材料を準備する装置
JP2005508265A (ja) * 2001-11-02 2005-03-31 アール.ピー. シェーラー テクノロジーズ インコーポレイテッド カプセル製品を製造する装置および方法

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