JPS5036150B1 - - Google Patents

Info

Publication number
JPS5036150B1
JPS5036150B1 JP46011564A JP1156471A JPS5036150B1 JP S5036150 B1 JPS5036150 B1 JP S5036150B1 JP 46011564 A JP46011564 A JP 46011564A JP 1156471 A JP1156471 A JP 1156471A JP S5036150 B1 JPS5036150 B1 JP S5036150B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP46011564A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5036150B1 publication Critical patent/JPS5036150B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W70/481—
    • H10W72/07236—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP46011564A 1967-11-22 1971-03-04 Pending JPS5036150B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US68509567A 1967-11-22 1967-11-22

Publications (1)

Publication Number Publication Date
JPS5036150B1 true JPS5036150B1 (ja) 1975-11-21

Family

ID=24750757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP46011564A Pending JPS5036150B1 (ja) 1967-11-22 1971-03-04

Country Status (2)

Country Link
US (1) US3553828A (ja)
JP (1) JPS5036150B1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3698073A (en) * 1970-10-13 1972-10-17 Motorola Inc Contact bonding and packaging of integrated circuits
DE2315711B2 (de) * 1973-03-29 1980-07-17 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Kontaktieren einer integrierten Schaltungsanordnung
DE2511209C3 (de) * 1975-03-14 1980-10-02 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum Kontaktieren der Elektroden von scheibenförmigen Halbleiterkörpern und Metallstreifen zur Durchführung des Verfahrens
DE2718267C2 (de) * 1977-04-25 1983-05-19 W.C. Heraeus Gmbh, 6450 Hanau Verfahren zum Herstellen von Leiterrahmen
US4607276A (en) * 1984-03-08 1986-08-19 Olin Corporation Tape packages
US5454905A (en) * 1994-08-09 1995-10-03 National Semiconductor Corporation Method for manufacturing fine pitch lead frame

Also Published As

Publication number Publication date
US3553828A (en) 1971-01-12

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