JPS5030744A - - Google Patents
Info
- Publication number
- JPS5030744A JPS5030744A JP8222973A JP8222973A JPS5030744A JP S5030744 A JPS5030744 A JP S5030744A JP 8222973 A JP8222973 A JP 8222973A JP 8222973 A JP8222973 A JP 8222973A JP S5030744 A JPS5030744 A JP S5030744A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8222973A JPS5248580B2 (en, 2012) | 1973-07-21 | 1973-07-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8222973A JPS5248580B2 (en, 2012) | 1973-07-21 | 1973-07-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5030744A true JPS5030744A (en, 2012) | 1975-03-27 |
| JPS5248580B2 JPS5248580B2 (en, 2012) | 1977-12-10 |
Family
ID=13768563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8222973A Expired JPS5248580B2 (en, 2012) | 1973-07-21 | 1973-07-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5248580B2 (en, 2012) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4265943A (en) * | 1978-11-27 | 1981-05-05 | Macdermid Incorporated | Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions |
| JPH0238580A (ja) * | 1988-07-28 | 1990-02-07 | Hitachi Chem Co Ltd | 無電解銅めっき方法 |
| JPH02141581A (ja) * | 1988-11-22 | 1990-05-30 | Hitachi Chem Co Ltd | 無電解銅めっき方法 |
| JP2011231382A (ja) * | 2010-04-28 | 2011-11-17 | Nagoya Plating Co Ltd | 高分子繊維のめっき液並びにこれを用いた高分子繊維のめっき方法及びその製造方法 |
| CN102534583A (zh) * | 2010-12-08 | 2012-07-04 | 比亚迪股份有限公司 | 一种化学镀铜液及一种化学镀铜方法 |
-
1973
- 1973-07-21 JP JP8222973A patent/JPS5248580B2/ja not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4265943A (en) * | 1978-11-27 | 1981-05-05 | Macdermid Incorporated | Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions |
| JPH0238580A (ja) * | 1988-07-28 | 1990-02-07 | Hitachi Chem Co Ltd | 無電解銅めっき方法 |
| JPH02141581A (ja) * | 1988-11-22 | 1990-05-30 | Hitachi Chem Co Ltd | 無電解銅めっき方法 |
| JP2011231382A (ja) * | 2010-04-28 | 2011-11-17 | Nagoya Plating Co Ltd | 高分子繊維のめっき液並びにこれを用いた高分子繊維のめっき方法及びその製造方法 |
| CN102534583A (zh) * | 2010-12-08 | 2012-07-04 | 比亚迪股份有限公司 | 一种化学镀铜液及一种化学镀铜方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5248580B2 (en, 2012) | 1977-12-10 |