JPS5026903B1 - - Google Patents
Info
- Publication number
- JPS5026903B1 JPS5026903B1 JP6647168A JP6647168A JPS5026903B1 JP S5026903 B1 JPS5026903 B1 JP S5026903B1 JP 6647168 A JP6647168 A JP 6647168A JP 6647168 A JP6647168 A JP 6647168A JP S5026903 B1 JPS5026903 B1 JP S5026903B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Dicing (AREA)
- Bipolar Transistors (AREA)
- Thyristors (AREA)
- Weting (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6647168A JPS5026903B1 (de) | 1968-09-14 | 1968-09-14 | |
| GB4290669A GB1246022A (en) | 1968-09-14 | 1969-08-28 | Method of manufacturing semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6647168A JPS5026903B1 (de) | 1968-09-14 | 1968-09-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5026903B1 true JPS5026903B1 (de) | 1975-09-04 |
Family
ID=13316716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6647168A Pending JPS5026903B1 (de) | 1968-09-14 | 1968-09-14 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS5026903B1 (de) |
| GB (1) | GB1246022A (de) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4974486A (de) * | 1972-11-17 | 1974-07-18 | ||
| FR2220877A1 (en) * | 1973-03-09 | 1974-10-04 | Thomson Csf | PIN diodes collectively made from PIN chip - are formed between electrodes by etching parallel trenches in two stages followed by separation |
| NL7609815A (nl) * | 1976-09-03 | 1978-03-07 | Philips Nv | Werkwijze voor het vervaardigen van een half- geleiderinrichting en halfgeleiderinrichting vervaardigd met behulp van de werkwijze. |
| DE4204436A1 (de) * | 1992-02-14 | 1993-08-19 | Daimler Benz Ag | Verfahren zur herstellung von halbleiterbauelementen aus duennen folien |
| DE4213118C1 (de) * | 1992-04-21 | 1993-06-24 | Ant Nachrichtentechnik Gmbh, 7150 Backnang, De |
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1968
- 1968-09-14 JP JP6647168A patent/JPS5026903B1/ja active Pending
-
1969
- 1969-08-28 GB GB4290669A patent/GB1246022A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1246022A (en) | 1971-09-15 |