JPS5017175A - - Google Patents
Info
- Publication number
- JPS5017175A JPS5017175A JP49049626A JP4962674A JPS5017175A JP S5017175 A JPS5017175 A JP S5017175A JP 49049626 A JP49049626 A JP 49049626A JP 4962674 A JP4962674 A JP 4962674A JP S5017175 A JPS5017175 A JP S5017175A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
Landscapes
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2322347A DE2322347A1 (de) | 1973-05-03 | 1973-05-03 | Verfahren zum herstellen eines halbleiterelementes mit isolierender schutzschicht |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5017175A true JPS5017175A (https=) | 1975-02-22 |
Family
ID=5879931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49049626A Pending JPS5017175A (https=) | 1973-05-03 | 1974-05-02 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS5017175A (https=) |
| DE (1) | DE2322347A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6195551A (ja) * | 1984-10-16 | 1986-05-14 | Matsushita Electric Ind Co Ltd | 集積回路の多層配線構造体 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2726667A1 (de) | 1977-06-14 | 1978-12-21 | Licentia Gmbh | Oberflaechenpassiviertes halbleiterbauelement und verfahren zum herstellen desselben |
| EP0831534A3 (de) * | 1996-09-24 | 1998-05-20 | Siemens Aktiengesellschaft | Halbleiterbauelement mit einer Passivierungsschicht |
| DE19741437A1 (de) * | 1997-09-19 | 1999-04-01 | Siemens Ag | Elektronisches Bauteil mit verbesserter Gehäusepreßmasse |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3615913A (en) * | 1968-11-08 | 1971-10-26 | Westinghouse Electric Corp | Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating |
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1973
- 1973-05-03 DE DE2322347A patent/DE2322347A1/de active Pending
-
1974
- 1974-05-02 JP JP49049626A patent/JPS5017175A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3615913A (en) * | 1968-11-08 | 1971-10-26 | Westinghouse Electric Corp | Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6195551A (ja) * | 1984-10-16 | 1986-05-14 | Matsushita Electric Ind Co Ltd | 集積回路の多層配線構造体 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2322347A1 (de) | 1974-11-14 |