JPS5017175A - - Google Patents
Info
- Publication number
- JPS5017175A JPS5017175A JP4962674A JP4962674A JPS5017175A JP S5017175 A JPS5017175 A JP S5017175A JP 4962674 A JP4962674 A JP 4962674A JP 4962674 A JP4962674 A JP 4962674A JP S5017175 A JPS5017175 A JP S5017175A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19732322347 DE2322347A1 (de) | 1973-05-03 | 1973-05-03 | Verfahren zum herstellen eines halbleiterelementes mit isolierender schutzschicht |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5017175A true JPS5017175A (enrdf_load_stackoverflow) | 1975-02-22 |
Family
ID=5879931
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4962674A Pending JPS5017175A (enrdf_load_stackoverflow) | 1973-05-03 | 1974-05-02 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS5017175A (enrdf_load_stackoverflow) |
DE (1) | DE2322347A1 (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6195551A (ja) * | 1984-10-16 | 1986-05-14 | Matsushita Electric Ind Co Ltd | 集積回路の多層配線構造体 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2726667A1 (de) | 1977-06-14 | 1978-12-21 | Licentia Gmbh | Oberflaechenpassiviertes halbleiterbauelement und verfahren zum herstellen desselben |
EP0831534A3 (de) * | 1996-09-24 | 1998-05-20 | Siemens Aktiengesellschaft | Halbleiterbauelement mit einer Passivierungsschicht |
DE19741437A1 (de) * | 1997-09-19 | 1999-04-01 | Siemens Ag | Elektronisches Bauteil mit verbesserter Gehäusepreßmasse |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3615913A (en) * | 1968-11-08 | 1971-10-26 | Westinghouse Electric Corp | Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating |
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1973
- 1973-05-03 DE DE19732322347 patent/DE2322347A1/de active Pending
-
1974
- 1974-05-02 JP JP4962674A patent/JPS5017175A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3615913A (en) * | 1968-11-08 | 1971-10-26 | Westinghouse Electric Corp | Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6195551A (ja) * | 1984-10-16 | 1986-05-14 | Matsushita Electric Ind Co Ltd | 集積回路の多層配線構造体 |
Also Published As
Publication number | Publication date |
---|---|
DE2322347A1 (de) | 1974-11-14 |