JPS5016731A - - Google Patents
Info
- Publication number
- JPS5016731A JPS5016731A JP48067502A JP6750273A JPS5016731A JP S5016731 A JPS5016731 A JP S5016731A JP 48067502 A JP48067502 A JP 48067502A JP 6750273 A JP6750273 A JP 6750273A JP S5016731 A JPS5016731 A JP S5016731A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48067502A JPS5016731A (fr) | 1973-06-15 | 1973-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48067502A JPS5016731A (fr) | 1973-06-15 | 1973-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5016731A true JPS5016731A (fr) | 1975-02-21 |
Family
ID=13346814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48067502A Pending JPS5016731A (fr) | 1973-06-15 | 1973-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5016731A (fr) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57190664A (en) * | 1982-03-04 | 1982-11-24 | Matsushita Electric Ind Co Ltd | Apparatus for coating viscous material |
| JPS5854578A (ja) * | 1981-09-29 | 1983-03-31 | 株式会社東芝 | シ−ズヒ−タ |
| JPS58183276U (ja) * | 1982-05-28 | 1983-12-06 | 日本電気ホームエレクトロニクス株式会社 | ペ−スト状接着材の供給装置 |
| JPS5924158U (ja) * | 1982-08-06 | 1984-02-15 | 株式会社スリ−ボンド | 接着・シ−ル剤用吐出ノズル構造 |
| KR20190003522A (ko) * | 2016-04-28 | 2019-01-09 | 스미토모덴키고교가부시키가이샤 | 합금 분말, 소결체, 합금 분말의 제조 방법 및 소결체의 제조 방법 |
-
1973
- 1973-06-15 JP JP48067502A patent/JPS5016731A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5854578A (ja) * | 1981-09-29 | 1983-03-31 | 株式会社東芝 | シ−ズヒ−タ |
| JPH0340474B2 (fr) * | 1981-09-29 | 1991-06-19 | ||
| JPS57190664A (en) * | 1982-03-04 | 1982-11-24 | Matsushita Electric Ind Co Ltd | Apparatus for coating viscous material |
| JPS58183276U (ja) * | 1982-05-28 | 1983-12-06 | 日本電気ホームエレクトロニクス株式会社 | ペ−スト状接着材の供給装置 |
| JPS5924158U (ja) * | 1982-08-06 | 1984-02-15 | 株式会社スリ−ボンド | 接着・シ−ル剤用吐出ノズル構造 |
| KR20190003522A (ko) * | 2016-04-28 | 2019-01-09 | 스미토모덴키고교가부시키가이샤 | 합금 분말, 소결체, 합금 분말의 제조 방법 및 소결체의 제조 방법 |