JPS50158281A - - Google Patents

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Publication number
JPS50158281A
JPS50158281A JP6505574A JP6505574A JPS50158281A JP S50158281 A JPS50158281 A JP S50158281A JP 6505574 A JP6505574 A JP 6505574A JP 6505574 A JP6505574 A JP 6505574A JP S50158281 A JPS50158281 A JP S50158281A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6505574A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6505574A priority Critical patent/JPS50158281A/ja
Publication of JPS50158281A publication Critical patent/JPS50158281A/ja
Pending legal-status Critical Current

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  • Weting (AREA)
JP6505574A 1974-06-10 1974-06-10 Pending JPS50158281A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6505574A JPS50158281A (fr) 1974-06-10 1974-06-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6505574A JPS50158281A (fr) 1974-06-10 1974-06-10

Publications (1)

Publication Number Publication Date
JPS50158281A true JPS50158281A (fr) 1975-12-22

Family

ID=13275871

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6505574A Pending JPS50158281A (fr) 1974-06-10 1974-06-10

Country Status (1)

Country Link
JP (1) JPS50158281A (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0665582A2 (fr) * 1994-01-28 1995-08-02 Wako Pure Chemical Industries Ltd Agents de traitement de surface et traitement de surface pour semi-conducteurs
JPWO2001071789A1 (ja) * 2000-03-21 2004-03-04 和光純薬工業株式会社 半導体基板洗浄剤及び洗浄方法
JP2010232406A (ja) * 2009-03-27 2010-10-14 Hikari Kobayashi 半導体基板の処理方法および半導体装置の製造方法。
EP2557147A1 (fr) 2011-08-09 2013-02-13 Basf Se Compositions aqueuses alcalines et procédé de traitement de la surface de substrats de silicone
US9076920B2 (en) 2010-06-09 2015-07-07 Basf Se Aqueous alkaline etching and cleaning composition and method for treating the surface of silicon substrates

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0665582A2 (fr) * 1994-01-28 1995-08-02 Wako Pure Chemical Industries Ltd Agents de traitement de surface et traitement de surface pour semi-conducteurs
US5580846A (en) * 1994-01-28 1996-12-03 Wako Pure Chemical Industries, Ltd. Surface treating agents and treating process for semiconductors
EP0665582B1 (fr) * 1994-01-28 2001-03-14 Wako Pure Chemical Industries Ltd Agents de traitement de surface et traitement de surface pour semi-conducteurs
JPWO2001071789A1 (ja) * 2000-03-21 2004-03-04 和光純薬工業株式会社 半導体基板洗浄剤及び洗浄方法
JP4821082B2 (ja) * 2000-03-21 2011-11-24 和光純薬工業株式会社 半導体基板洗浄剤及び洗浄方法
JP2010232406A (ja) * 2009-03-27 2010-10-14 Hikari Kobayashi 半導体基板の処理方法および半導体装置の製造方法。
US9076920B2 (en) 2010-06-09 2015-07-07 Basf Se Aqueous alkaline etching and cleaning composition and method for treating the surface of silicon substrates
EP2557147A1 (fr) 2011-08-09 2013-02-13 Basf Se Compositions aqueuses alcalines et procédé de traitement de la surface de substrats de silicone

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