JPS50155973A - - Google Patents
Info
- Publication number
- JPS50155973A JPS50155973A JP6400474A JP6400474A JPS50155973A JP S50155973 A JPS50155973 A JP S50155973A JP 6400474 A JP6400474 A JP 6400474A JP 6400474 A JP6400474 A JP 6400474A JP S50155973 A JPS50155973 A JP S50155973A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49064004A JPS5836500B2 (ja) | 1974-06-07 | 1974-06-07 | Ｉｃ用セラミック基板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49064004A JPS5836500B2 (ja) | 1974-06-07 | 1974-06-07 | Ｉｃ用セラミック基板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50155973A true JPS50155973A (cs) | 1975-12-16 |
| JPS5836500B2 JPS5836500B2 (ja) | 1983-08-09 |
Family
ID=13245606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49064004A Expired JPS5836500B2 (ja) | 1974-06-07 | 1974-06-07 | Ｉｃ用セラミック基板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5836500B2 (cs) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58116233U (ja) * | 1982-02-01 | 1983-08-08 | 株式会社日立製作所 | 印刷配線板用放熱フイン構造 |
| JPS5998649U (ja) * | 1982-12-22 | 1984-07-04 | 京セラ株式会社 | チツプキヤリア |
| JPS62174341U (cs) * | 1986-04-25 | 1987-11-05 | ||
| JPH0338653U (cs) * | 1989-08-24 | 1991-04-15 | ||
| JPH06112375A (ja) * | 1992-09-24 | 1994-04-22 | Kyocera Corp | 半導体素子収納用パッケージ |
| JP2006229151A (ja) * | 2005-02-21 | 2006-08-31 | Kyocera Corp | 発光素子用配線基板ならびに発光装置 |
| JP2007096009A (ja) * | 2005-09-29 | 2007-04-12 | Sanyo Electric Co Ltd | 積層回路基板及びこれを具えた携帯型電子機器 |
| JP2013512560A (ja) * | 2009-11-27 | 2013-04-11 | テチェン カンパニー リミテッド | パワーｌｅｄを有する大型照明灯の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5057388A (cs) * | 1973-09-19 | 1975-05-19 |
-
1974
- 1974-06-07 JP JP49064004A patent/JPS5836500B2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5057388A (cs) * | 1973-09-19 | 1975-05-19 |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58116233U (ja) * | 1982-02-01 | 1983-08-08 | 株式会社日立製作所 | 印刷配線板用放熱フイン構造 |
| JPS5998649U (ja) * | 1982-12-22 | 1984-07-04 | 京セラ株式会社 | チツプキヤリア |
| JPS62174341U (cs) * | 1986-04-25 | 1987-11-05 | ||
| JPH0338653U (cs) * | 1989-08-24 | 1991-04-15 | ||
| JPH06112375A (ja) * | 1992-09-24 | 1994-04-22 | Kyocera Corp | 半導体素子収納用パッケージ |
| JP2006229151A (ja) * | 2005-02-21 | 2006-08-31 | Kyocera Corp | 発光素子用配線基板ならびに発光装置 |
| JP4699042B2 (ja) * | 2005-02-21 | 2011-06-08 | 京セラ株式会社 | 発光素子用配線基板ならびに発光装置 |
| JP2007096009A (ja) * | 2005-09-29 | 2007-04-12 | Sanyo Electric Co Ltd | 積層回路基板及びこれを具えた携帯型電子機器 |
| JP2013512560A (ja) * | 2009-11-27 | 2013-04-11 | テチェン カンパニー リミテッド | パワーｌｅｄを有する大型照明灯の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5836500B2 (ja) | 1983-08-09 |