JPS50147292A - - Google Patents

Info

Publication number
JPS50147292A
JPS50147292A JP49054197A JP5419774A JPS50147292A JP S50147292 A JPS50147292 A JP S50147292A JP 49054197 A JP49054197 A JP 49054197A JP 5419774 A JP5419774 A JP 5419774A JP S50147292 A JPS50147292 A JP S50147292A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49054197A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP49054197A priority Critical patent/JPS50147292A/ja
Publication of JPS50147292A publication Critical patent/JPS50147292A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
JP49054197A 1974-05-15 1974-05-15 Pending JPS50147292A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49054197A JPS50147292A (ja) 1974-05-15 1974-05-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49054197A JPS50147292A (ja) 1974-05-15 1974-05-15

Publications (1)

Publication Number Publication Date
JPS50147292A true JPS50147292A (ja) 1975-11-26

Family

ID=12963804

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49054197A Pending JPS50147292A (ja) 1974-05-15 1974-05-15

Country Status (1)

Country Link
JP (1) JPS50147292A (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58166732A (ja) * 1982-03-10 1983-10-01 テキサス・インスツルメンツ・インコ−ポレイテツド 半導体装置相互接続システム
JPS594064A (ja) * 1982-06-18 1984-01-10 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン 高周波回路装置
JPS60207358A (ja) * 1984-03-30 1985-10-18 Nec Kansai Ltd ハイブリツドｉｃ
JPS62262437A (ja) * 1986-05-08 1987-11-14 Nec Corp 混成集積回路装置
JPS62265732A (ja) * 1986-05-13 1987-11-18 Nec Corp 混成集積回路装置
JPS62265734A (ja) * 1986-05-13 1987-11-18 Nec Corp 混成集積回路装置
JPS62265733A (ja) * 1986-05-13 1987-11-18 Nec Corp 混成集積回路装置
WO1998049726A1 (fr) * 1997-04-30 1998-11-05 Hitachi Chemical Company, Ltd. Plaquette pour monter un element a semi-conducteur, procede permettant de la produire et dispositif a semi-conducteur
US6492203B1 (en) 1997-04-30 2002-12-10 Hitachi Chemical Company, Ltd. Semiconductor device and method of fabrication thereof
US6617193B1 (en) 1997-04-30 2003-09-09 Hitachi Chemical Company, Ltd. Semiconductor device, semiconductor device substrate, and methods of fabricating the same

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58166732A (ja) * 1982-03-10 1983-10-01 テキサス・インスツルメンツ・インコ−ポレイテツド 半導体装置相互接続システム
JPS594064A (ja) * 1982-06-18 1984-01-10 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン 高周波回路装置
JPS60207358A (ja) * 1984-03-30 1985-10-18 Nec Kansai Ltd ハイブリツドｉｃ
JPS62262437A (ja) * 1986-05-08 1987-11-14 Nec Corp 混成集積回路装置
JPS62265732A (ja) * 1986-05-13 1987-11-18 Nec Corp 混成集積回路装置
JPS62265734A (ja) * 1986-05-13 1987-11-18 Nec Corp 混成集積回路装置
JPS62265733A (ja) * 1986-05-13 1987-11-18 Nec Corp 混成集積回路装置
WO1998049726A1 (fr) * 1997-04-30 1998-11-05 Hitachi Chemical Company, Ltd. Plaquette pour monter un element a semi-conducteur, procede permettant de la produire et dispositif a semi-conducteur
US6268648B1 (en) 1997-04-30 2001-07-31 Hitachi Chemical Co., Ltd. Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device
US6492203B1 (en) 1997-04-30 2002-12-10 Hitachi Chemical Company, Ltd. Semiconductor device and method of fabrication thereof
US6617193B1 (en) 1997-04-30 2003-09-09 Hitachi Chemical Company, Ltd. Semiconductor device, semiconductor device substrate, and methods of fabricating the same

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