JPS50139678A - - Google Patents

Info

Publication number
JPS50139678A
JPS50139678A JP50045743A JP4574375A JPS50139678A JP S50139678 A JPS50139678 A JP S50139678A JP 50045743 A JP50045743 A JP 50045743A JP 4574375 A JP4574375 A JP 4574375A JP S50139678 A JPS50139678 A JP S50139678A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50045743A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS50139678A publication Critical patent/JPS50139678A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0123Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/03Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H10P32/1406
    • H10P32/171
    • H10P95/00

Landscapes

  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
JP50045743A 1974-04-15 1975-04-14 Pending JPS50139678A (show.php)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US461111A US3876472A (en) 1974-04-15 1974-04-15 Method of achieving semiconductor substrates having similar surface resistivity

Publications (1)

Publication Number Publication Date
JPS50139678A true JPS50139678A (show.php) 1975-11-08

Family

ID=23831272

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50045743A Pending JPS50139678A (show.php) 1974-04-15 1975-04-14

Country Status (4)

Country Link
US (1) US3876472A (show.php)
JP (1) JPS50139678A (show.php)
DE (1) DE2515431A1 (show.php)
FR (1) FR2267638A1 (show.php)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS558019A (en) * 1978-06-30 1980-01-21 Nec Corp Semiconductor device
JPS55148465A (en) * 1979-05-09 1980-11-19 Nec Corp Manufacture of complementary mos integrated circuit device
JPS5630766A (en) * 1979-08-20 1981-03-27 Gen Instrument Corp Method of manufacturing semiconductor device
JPS58148465A (ja) * 1982-02-26 1983-09-03 Mitsubishi Electric Corp 半導体装置
JPH01164062A (ja) * 1988-11-18 1989-06-28 Hitachi Ltd 半導体装置の製造方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4078947A (en) * 1976-08-05 1978-03-14 International Business Machines Corporation Method for forming a narrow channel length MOS field effect transistor
US4409726A (en) * 1982-04-08 1983-10-18 Philip Shiota Method of making well regions for CMOS devices
US4713329A (en) * 1985-07-22 1987-12-15 Data General Corporation Well mask for CMOS process
JPH0797606B2 (ja) * 1986-10-22 1995-10-18 株式会社日立製作所 半導体集積回路装置の製造方法
US6090671A (en) * 1997-09-30 2000-07-18 Siemens Aktiengesellschaft Reduction of gate-induced drain leakage in semiconductor devices
CN112687538B (zh) * 2020-12-18 2024-03-08 北京华卓精科科技股份有限公司 激光退火熔化深度确定方法、装置及电子设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1261723A (en) * 1968-03-11 1972-01-26 Associated Semiconductor Mft Improvements in and relating to semiconductor devices
US3666567A (en) * 1970-01-15 1972-05-30 Hughes Aircraft Co Method of forming an ohmic contact region in a thin semiconductor layer
US3793088A (en) * 1972-11-15 1974-02-19 Bell Telephone Labor Inc Compatible pnp and npn devices in an integrated circuit

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS558019A (en) * 1978-06-30 1980-01-21 Nec Corp Semiconductor device
JPS55148465A (en) * 1979-05-09 1980-11-19 Nec Corp Manufacture of complementary mos integrated circuit device
JPS5630766A (en) * 1979-08-20 1981-03-27 Gen Instrument Corp Method of manufacturing semiconductor device
JPS58148465A (ja) * 1982-02-26 1983-09-03 Mitsubishi Electric Corp 半導体装置
JPH01164062A (ja) * 1988-11-18 1989-06-28 Hitachi Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
US3876472A (en) 1975-04-08
FR2267638A1 (show.php) 1975-11-07
DE2515431A1 (de) 1975-10-23

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