FR2267638A1 - - Google Patents
Info
- Publication number
- FR2267638A1 FR2267638A1 FR7511398A FR7511398A FR2267638A1 FR 2267638 A1 FR2267638 A1 FR 2267638A1 FR 7511398 A FR7511398 A FR 7511398A FR 7511398 A FR7511398 A FR 7511398A FR 2267638 A1 FR2267638 A1 FR 2267638A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2251—Diffusion into or out of group IV semiconductors
- H01L21/2252—Diffusion into or out of group IV semiconductors using predeposition of impurities into the semiconductor surface, e.g. from a gaseous phase
- H01L21/2253—Diffusion into or out of group IV semiconductors using predeposition of impurities into the semiconductor surface, e.g. from a gaseous phase by ion implantation
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US461111A US3876472A (en) | 1974-04-15 | 1974-04-15 | Method of achieving semiconductor substrates having similar surface resistivity |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2267638A1 true FR2267638A1 (fr) | 1975-11-07 |
Family
ID=23831272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7511398A Withdrawn FR2267638A1 (fr) | 1974-04-15 | 1975-04-11 |
Country Status (4)
Country | Link |
---|---|
US (1) | US3876472A (fr) |
JP (1) | JPS50139678A (fr) |
DE (1) | DE2515431A1 (fr) |
FR (1) | FR2267638A1 (fr) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4078947A (en) * | 1976-08-05 | 1978-03-14 | International Business Machines Corporation | Method for forming a narrow channel length MOS field effect transistor |
JPS558019A (en) * | 1978-06-30 | 1980-01-21 | Nec Corp | Semiconductor device |
JPS55148465A (en) * | 1979-05-09 | 1980-11-19 | Nec Corp | Manufacture of complementary mos integrated circuit device |
CA1131797A (fr) * | 1979-08-20 | 1982-09-14 | Jagir S. Multani | Fabrication d'un dispositif semiconducteur dans une couche epitaxiale simulee |
JPS58148465A (ja) * | 1982-02-26 | 1983-09-03 | Mitsubishi Electric Corp | 半導体装置 |
US4409726A (en) * | 1982-04-08 | 1983-10-18 | Philip Shiota | Method of making well regions for CMOS devices |
US4713329A (en) * | 1985-07-22 | 1987-12-15 | Data General Corporation | Well mask for CMOS process |
JPH0797606B2 (ja) * | 1986-10-22 | 1995-10-18 | 株式会社日立製作所 | 半導体集積回路装置の製造方法 |
JPH01164062A (ja) * | 1988-11-18 | 1989-06-28 | Hitachi Ltd | 半導体装置の製造方法 |
US6090671A (en) * | 1997-09-30 | 2000-07-18 | Siemens Aktiengesellschaft | Reduction of gate-induced drain leakage in semiconductor devices |
CN112687538B (zh) * | 2020-12-18 | 2024-03-08 | 北京华卓精科科技股份有限公司 | 激光退火熔化深度确定方法、装置及电子设备 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1261723A (en) * | 1968-03-11 | 1972-01-26 | Associated Semiconductor Mft | Improvements in and relating to semiconductor devices |
US3666567A (en) * | 1970-01-15 | 1972-05-30 | Hughes Aircraft Co | Method of forming an ohmic contact region in a thin semiconductor layer |
US3793088A (en) * | 1972-11-15 | 1974-02-19 | Bell Telephone Labor Inc | Compatible pnp and npn devices in an integrated circuit |
-
1974
- 1974-04-15 US US461111A patent/US3876472A/en not_active Expired - Lifetime
-
1975
- 1975-04-09 DE DE19752515431 patent/DE2515431A1/de active Pending
- 1975-04-11 FR FR7511398A patent/FR2267638A1/fr not_active Withdrawn
- 1975-04-14 JP JP50045743A patent/JPS50139678A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US3876472A (en) | 1975-04-08 |
DE2515431A1 (de) | 1975-10-23 |
JPS50139678A (fr) | 1975-11-08 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |