JPS50139671A - - Google Patents

Info

Publication number
JPS50139671A
JPS50139671A JP49045954A JP4595474A JPS50139671A JP S50139671 A JPS50139671 A JP S50139671A JP 49045954 A JP49045954 A JP 49045954A JP 4595474 A JP4595474 A JP 4595474A JP S50139671 A JPS50139671 A JP S50139671A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49045954A
Other languages
Japanese (ja)
Other versions
JPS5731298B2 (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4595474A priority Critical patent/JPS5731298B2/ja
Publication of JPS50139671A publication Critical patent/JPS50139671A/ja
Publication of JPS5731298B2 publication Critical patent/JPS5731298B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP4595474A 1974-04-25 1974-04-25 Expired JPS5731298B2 (cg-RX-API-DMAC7.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4595474A JPS5731298B2 (cg-RX-API-DMAC7.html) 1974-04-25 1974-04-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4595474A JPS5731298B2 (cg-RX-API-DMAC7.html) 1974-04-25 1974-04-25

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP56176057A Division JPS57103342A (en) 1981-11-02 1981-11-02 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS50139671A true JPS50139671A (cg-RX-API-DMAC7.html) 1975-11-08
JPS5731298B2 JPS5731298B2 (cg-RX-API-DMAC7.html) 1982-07-03

Family

ID=12733659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4595474A Expired JPS5731298B2 (cg-RX-API-DMAC7.html) 1974-04-25 1974-04-25

Country Status (1)

Country Link
JP (1) JPS5731298B2 (cg-RX-API-DMAC7.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57143835A (en) * 1981-02-27 1982-09-06 Citizen Watch Co Ltd Mounting method of ic
JPS63291445A (ja) * 1987-05-23 1988-11-29 Fuji Plant Kogyo Kk リ−ドフレ−ムへの２色部分メッキ方法
JPH02209742A (ja) * 1988-09-16 1990-08-21 Natl Semiconductor Corp <Ns> テープ自動化ボンディングプロセス用の金／錫共晶ボンディング

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57143835A (en) * 1981-02-27 1982-09-06 Citizen Watch Co Ltd Mounting method of ic
JPS63291445A (ja) * 1987-05-23 1988-11-29 Fuji Plant Kogyo Kk リ−ドフレ−ムへの２色部分メッキ方法
JPH02209742A (ja) * 1988-09-16 1990-08-21 Natl Semiconductor Corp <Ns> テープ自動化ボンディングプロセス用の金／錫共晶ボンディング

Also Published As

Publication number Publication date
JPS5731298B2 (cg-RX-API-DMAC7.html) 1982-07-03

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