JPS50133596A - - Google Patents

Info

Publication number
JPS50133596A
JPS50133596A JP49039993A JP3999374A JPS50133596A JP S50133596 A JPS50133596 A JP S50133596A JP 49039993 A JP49039993 A JP 49039993A JP 3999374 A JP3999374 A JP 3999374A JP S50133596 A JPS50133596 A JP S50133596A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49039993A
Other languages
Japanese (ja)
Other versions
JPS5911423B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP49039993A priority Critical patent/JPS5911423B2/ja
Publication of JPS50133596A publication Critical patent/JPS50133596A/ja
Publication of JPS5911423B2 publication Critical patent/JPS5911423B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP49039993A 1974-04-10 1974-04-10 ラツピング装置 Expired JPS5911423B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49039993A JPS5911423B2 (ja) 1974-04-10 1974-04-10 ラツピング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49039993A JPS5911423B2 (ja) 1974-04-10 1974-04-10 ラツピング装置

Publications (2)

Publication Number Publication Date
JPS50133596A true JPS50133596A (enrdf_load_stackoverflow) 1975-10-22
JPS5911423B2 JPS5911423B2 (ja) 1984-03-15

Family

ID=12568445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49039993A Expired JPS5911423B2 (ja) 1974-04-10 1974-04-10 ラツピング装置

Country Status (1)

Country Link
JP (1) JPS5911423B2 (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5258206A (en) * 1975-11-08 1977-05-13 Mitsui Toatsu Chemicals Method of drain grid crib work for face of siope
JPS5596267A (en) * 1979-01-12 1980-07-22 Citizen Watch Co Ltd Parts working method
JPH0679618A (ja) * 1991-12-20 1994-03-22 Cybeq Syst Inc 研磨ヘッド、エッジリテイナの使用方法及びこのエッジリテイナを使用するための装置
US5916412A (en) * 1996-02-16 1999-06-29 Ebara Corporation Apparatus for and method of polishing workpiece
US6033520A (en) * 1995-10-09 2000-03-07 Ebara Corporation Apparatus for and method of polishing workpiece
US6231428B1 (en) 1999-03-03 2001-05-15 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6368189B1 (en) 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2826009A (en) * 1954-12-10 1958-03-11 Crane Packing Co Work holder for lapping machines

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2826009A (en) * 1954-12-10 1958-03-11 Crane Packing Co Work holder for lapping machines

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5258206A (en) * 1975-11-08 1977-05-13 Mitsui Toatsu Chemicals Method of drain grid crib work for face of siope
JPS5596267A (en) * 1979-01-12 1980-07-22 Citizen Watch Co Ltd Parts working method
JPH0679618A (ja) * 1991-12-20 1994-03-22 Cybeq Syst Inc 研磨ヘッド、エッジリテイナの使用方法及びこのエッジリテイナを使用するための装置
US6033520A (en) * 1995-10-09 2000-03-07 Ebara Corporation Apparatus for and method of polishing workpiece
US6432258B1 (en) * 1995-10-09 2002-08-13 Ebara Corporation Apparatus for and method of polishing workpiece
US5916412A (en) * 1996-02-16 1999-06-29 Ebara Corporation Apparatus for and method of polishing workpiece
US6350346B1 (en) 1996-02-16 2002-02-26 Ebara Corporation Apparatus for polishing workpiece
US6231428B1 (en) 1999-03-03 2001-05-15 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6309290B1 (en) 1999-03-03 2001-10-30 Mitsubishi Materials Corporation Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control
US6368189B1 (en) 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US7029382B2 (en) 1999-03-03 2006-04-18 Ebara Corporation Apparatus for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US7311586B2 (en) 1999-03-03 2007-12-25 Ebara Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure

Also Published As

Publication number Publication date
JPS5911423B2 (ja) 1984-03-15

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