JPS50123277A - - Google Patents

Info

Publication number
JPS50123277A
JPS50123277A JP49030486A JP3048674A JPS50123277A JP S50123277 A JPS50123277 A JP S50123277A JP 49030486 A JP49030486 A JP 49030486A JP 3048674 A JP3048674 A JP 3048674A JP S50123277 A JPS50123277 A JP S50123277A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49030486A
Other languages
Japanese (ja)
Other versions
JPS5241149B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP49030486A priority Critical patent/JPS5241149B2/ja
Priority to US05/559,393 priority patent/US4036291A/en
Publication of JPS50123277A publication Critical patent/JPS50123277A/ja
Publication of JPS5241149B2 publication Critical patent/JPS5241149B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Rectifiers (AREA)
JP49030486A 1974-03-16 1974-03-16 Expired JPS5241149B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP49030486A JPS5241149B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-03-16 1974-03-16
US05/559,393 US4036291A (en) 1974-03-16 1975-03-17 Cooling device for electric device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49030486A JPS5241149B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-03-16 1974-03-16

Publications (2)

Publication Number Publication Date
JPS50123277A true JPS50123277A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1975-09-27
JPS5241149B2 JPS5241149B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1977-10-17

Family

ID=12305154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49030486A Expired JPS5241149B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-03-16 1974-03-16

Country Status (2)

Country Link
US (1) US4036291A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS5241149B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5263678A (en) * 1975-11-21 1977-05-26 Toshiba Corp Cooling device for semiconductors
JPS5296443U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1976-01-19 1977-07-19
JPS5299075A (en) * 1976-02-16 1977-08-19 Hitachi Ltd Vapor cooler
JPS53149567U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1977-04-30 1978-11-25
JPS5426587A (en) * 1977-07-30 1979-02-28 Amada Co Ltd Shape steel drilling device
US4864385A (en) * 1987-12-29 1989-09-05 Hitachi, Ltd. Power semiconductors connected antiparallel via heatsinks

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2638909A1 (de) * 1976-08-28 1978-03-02 Semikron Gleichrichterbau Halbleiteranordnung
US4203129A (en) * 1978-07-11 1980-05-13 International Business Machines Corporation Bubble generating tunnels for cooling semiconductor devices
DE3307703A1 (de) * 1983-03-04 1984-09-06 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau Dosen-siedekuehleinrichtung fuer leistungshalbleiterelemente
DE3444173C2 (de) * 1984-12-04 1994-05-19 Bbc Brown Boveri & Cie Siedekühleinrichtung für Leistungshalbleiterelemente
FR2592988B1 (fr) * 1986-01-16 1988-03-18 Jeumont Schneider Dispositifs de refroidissement de semi-conducteurs
US4897262A (en) * 1988-03-22 1990-01-30 Playtex Jhirmack, Inc. Non-aerosol hair spray composition
US4866570A (en) * 1988-08-05 1989-09-12 Ncr Corporation Apparatus and method for cooling an electronic device
US5036908A (en) * 1988-10-19 1991-08-06 Gas Research Institute High inlet artery for thermosyphons
US4948554A (en) * 1989-01-06 1990-08-14 General Electric Company Natural circulating passive cooling system for nuclear reactor containment structure
US5168919A (en) * 1990-06-29 1992-12-08 Digital Equipment Corporation Air cooled heat exchanger for multi-chip assemblies
DE4307902C1 (de) * 1993-03-12 1994-06-09 Bosch Gmbh Robert Kühlbare Einrichtung zur Aufnahme elektrischer Baugruppen
US5704416A (en) * 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
DE4402918C2 (de) * 1994-02-01 1998-03-12 Export Contor Ausenhandelsgese Kühlkörper mit Flüssigkeitsfüllung
FR2746177B1 (fr) * 1996-03-14 2000-04-07 Dispositif de refroidissement utilisant un refrigerant en ebullition et se condensant
DE19758444C2 (de) * 1997-04-04 1999-12-09 Gruendl & Hoffmann Fluidgekühlte, Rechnereinheit - gesteuerte Baugruppe zum Schalten elektrischer Leistungen
US5899265A (en) * 1997-04-08 1999-05-04 Sundstrand Corporation Reflux cooler coupled with heat pipes to enhance load-sharing
RU2201014C2 (ru) * 2000-01-12 2003-03-20 Мордовский государственный университет им. Н.П.Огарева Устройство для охлаждения силовых полупроводниковых приборов
US7556086B2 (en) * 2001-04-06 2009-07-07 University Of Maryland, College Park Orientation-independent thermosyphon heat spreader
DE10258354B3 (de) * 2002-12-12 2004-07-29 Framatome Anp Gmbh Sicherheitsbehälter einer Kernkraftanlage
JP2005140492A (ja) * 2003-06-12 2005-06-02 Denso Corp 対向振動流型熱輸送装置
TW577969B (en) * 2003-07-21 2004-03-01 Arro Superconducting Technolog Vapor/liquid separated heat exchanging device
US7431071B2 (en) * 2003-10-15 2008-10-07 Thermal Corp. Fluid circuit heat transfer device for plural heat sources
JP4394946B2 (ja) * 2003-12-24 2010-01-06 本田技研工業株式会社 燃料電池車
JP4573525B2 (ja) * 2003-12-24 2010-11-04 本田技研工業株式会社 固体高分子電解質型燃料電池
US7677052B2 (en) * 2005-03-28 2010-03-16 Intel Corporation Systems for improved passive liquid cooling
JP5403617B2 (ja) * 2008-02-08 2014-01-29 国立大学法人横浜国立大学 自励振動型ヒートパイプ
EP2331846B1 (de) * 2008-10-01 2013-08-14 MAGNA STEYR Fahrzeugtechnik AG & Co KG Entlüftungsvorrichtung für getriebe mit wasser enthaltendem schmierstoff
US7791884B2 (en) * 2008-11-10 2010-09-07 Rockwell Automation Technologies, Inc. Motor drive with heat pipe air cooling
US8634193B2 (en) 2011-12-05 2014-01-21 Rockwell Automation Technologies, Inc. Device and method using induction to improve natural convection cooling
US10113808B2 (en) * 2013-06-26 2018-10-30 Tai-Her Yang Heat-dissipating structure having suspended external tube and internally recycling heat transfer fluid and application apparatus
US20150000882A1 (en) * 2013-06-26 2015-01-01 Tai-Her Yang Heat-Dissipating Structure Having Suspended External Tube And Internally Recycling Heat Transfer Fluid And Application Apparatus
US10281218B2 (en) * 2013-06-26 2019-05-07 Tai-Her Yang Heat-dissipating structure having suspended external tube and internally recycling heat transfer fluid and application apparatus
US20160201992A1 (en) * 2015-01-09 2016-07-14 Delta Electronics, Inc. Heat pipe
JP6862304B2 (ja) * 2017-07-06 2021-04-21 株式会社東芝 ヒートパイプ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3609991A (en) * 1969-10-13 1971-10-05 Ibm Cooling system having thermally induced circulation
US3633665A (en) * 1970-05-11 1972-01-11 Atomic Energy Commission Heat exchanger using thermal convection tubes
US3741292A (en) * 1971-06-30 1973-06-26 Ibm Liquid encapsulated air cooled module

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5263678A (en) * 1975-11-21 1977-05-26 Toshiba Corp Cooling device for semiconductors
JPS5296443U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1976-01-19 1977-07-19
JPS5299075A (en) * 1976-02-16 1977-08-19 Hitachi Ltd Vapor cooler
JPS53149567U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1977-04-30 1978-11-25
JPS5426587A (en) * 1977-07-30 1979-02-28 Amada Co Ltd Shape steel drilling device
US4864385A (en) * 1987-12-29 1989-09-05 Hitachi, Ltd. Power semiconductors connected antiparallel via heatsinks

Also Published As

Publication number Publication date
JPS5241149B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1977-10-17
US4036291A (en) 1977-07-19

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