|
DE2638909A1
(de)
*
|
1976-08-28 |
1978-03-02 |
Semikron Gleichrichterbau |
Halbleiteranordnung
|
|
US4142577A
(en)
*
|
1977-03-10 |
1979-03-06 |
Erwin Klein |
Cooling device for a liquid-cooled semiconductor power component
|
|
JPS55129462U
(enExample)
*
|
1979-03-08 |
1980-09-12 |
|
|
|
JPS5749787A
(en)
*
|
1980-09-08 |
1982-03-23 |
Hitachi Ltd |
Boiling cooler
|
|
FR2492169A1
(fr)
*
|
1980-10-09 |
1982-04-16 |
Aerospatiale |
Support pour cellule photovoltaique, batterie de cellules photovoltaiques pourvues d'un tel support et generateur solaire pourvu d'une telle batterie
|
|
DE3307703A1
(de)
*
|
1983-03-04 |
1984-09-06 |
BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau |
Dosen-siedekuehleinrichtung fuer leistungshalbleiterelemente
|
|
FR2588072B1
(fr)
*
|
1985-09-30 |
1987-12-11 |
Jeumont Schneider |
Installation de dissipation pour elements semi-conducteurs de puissance
|
|
US4759403A
(en)
*
|
1986-04-30 |
1988-07-26 |
International Business Machines Corp. |
Hydraulic manifold for water cooling of multi-chip electric modules
|
|
DE3719637A1
(de)
*
|
1987-06-12 |
1988-12-29 |
Asea Brown Boveri |
Siedekuehleinrichtung fuer halbleiterelemente
|
|
US4938279A
(en)
*
|
1988-02-05 |
1990-07-03 |
Hughes Aircraft Company |
Flexible membrane heat sink
|
|
EP0582213B1
(de)
*
|
1992-08-04 |
1996-09-04 |
ABBPATENT GmbH |
Spannverband mit Halbleiterzellen und Kühldosen
|
|
US5394936A
(en)
*
|
1993-03-12 |
1995-03-07 |
Intel Corporation |
High efficiency heat removal system for electric devices and the like
|
|
JPH08340189A
(ja)
*
|
1995-04-14 |
1996-12-24 |
Nippondenso Co Ltd |
沸騰冷却装置
|
|
SE9604705L
(sv)
|
1996-12-20 |
1998-06-21 |
Ericsson Telefon Ab L M |
Förfarande och medel för att arrangera värmeöverföring
|
|
JP3964580B2
(ja)
*
|
1999-09-03 |
2007-08-22 |
富士通株式会社 |
冷却ユニット
|
|
US6611071B2
(en)
|
2001-08-17 |
2003-08-26 |
Siemens Automotive Inc. |
Embedded electronics for high convection cooling in an engine cooling motor application
|
|
US6980450B2
(en)
*
|
2002-01-24 |
2005-12-27 |
Inverters Unlimited, Inc. |
High power density inverter and components thereof
|
|
US20060162903A1
(en)
*
|
2005-01-21 |
2006-07-27 |
Bhatti Mohinder S |
Liquid cooled thermosiphon with flexible partition
|
|
US7077189B1
(en)
*
|
2005-01-21 |
2006-07-18 |
Delphi Technologies, Inc. |
Liquid cooled thermosiphon with flexible coolant tubes
|
|
US7506682B2
(en)
*
|
2005-01-21 |
2009-03-24 |
Delphi Technologies, Inc. |
Liquid cooled thermosiphon for electronic components
|
|
US8978741B2
(en)
*
|
2006-02-17 |
2015-03-17 |
Hewlett-Packard Development Company, L.P. |
Device for reducing temperature variations in plenums
|
|
WO2007147888A1
(en)
*
|
2006-06-22 |
2007-12-27 |
Basf Se |
Malononitrile compounds
|
|
FI122741B
(fi)
*
|
2006-09-29 |
2012-06-15 |
Vacon Oyj |
Tehomuuttajan tehokomponenttien jäähdytys
|
|
US20100006132A1
(en)
*
|
2008-07-14 |
2010-01-14 |
Lucent Technologies, Inc. |
Stacked Thermoelectric Modules
|
|
WO2010025129A1
(en)
*
|
2008-08-25 |
2010-03-04 |
Despatch Industries Limited Partnership |
Enclosure and method for temperature-sensitive components
|
|
US9464854B2
(en)
*
|
2013-02-01 |
2016-10-11 |
Dell Products, Lp |
Techniques for controlling vapor pressure in an immersion cooling tank
|
|
ES2608253B1
(es)
*
|
2015-10-06 |
2018-02-20 |
Universitat De Girona |
Dispositivo termoeléctrico tubular, instalación termoeléctrica y procedimiento de fabricación correspondiente
|
|
CN106026617A
(zh)
*
|
2016-07-06 |
2016-10-12 |
中国科学院电工研究所 |
一种集中冷却式变流器
|
|
US10966349B1
(en)
|
2020-07-27 |
2021-03-30 |
Bitfury Ip B.V. |
Two-phase immersion cooling apparatus with active vapor management
|