JPS50123276A - - Google Patents
Info
- Publication number
- JPS50123276A JPS50123276A JP49030410A JP3041074A JPS50123276A JP S50123276 A JPS50123276 A JP S50123276A JP 49030410 A JP49030410 A JP 49030410A JP 3041074 A JP3041074 A JP 3041074A JP S50123276 A JPS50123276 A JP S50123276A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Rectifiers (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3041074A JPS5512740B2 (US07368563-20080506-C00056.png) | 1974-03-15 | 1974-03-15 | |
| US05/557,892 US4020399A (en) | 1974-03-15 | 1975-03-12 | Vapor cooling device for dissipating heat of semiconductor elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3041074A JPS5512740B2 (US07368563-20080506-C00056.png) | 1974-03-15 | 1974-03-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50123276A true JPS50123276A (US07368563-20080506-C00056.png) | 1975-09-27 |
| JPS5512740B2 JPS5512740B2 (US07368563-20080506-C00056.png) | 1980-04-03 |
Family
ID=12303165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3041074A Expired JPS5512740B2 (US07368563-20080506-C00056.png) | 1974-03-15 | 1974-03-15 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4020399A (US07368563-20080506-C00056.png) |
| JP (1) | JPS5512740B2 (US07368563-20080506-C00056.png) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2638909A1 (de) * | 1976-08-28 | 1978-03-02 | Semikron Gleichrichterbau | Halbleiteranordnung |
| US4142577A (en) * | 1977-03-10 | 1979-03-06 | Erwin Klein | Cooling device for a liquid-cooled semiconductor power component |
| JPS55129462U (US07368563-20080506-C00056.png) * | 1979-03-08 | 1980-09-12 | ||
| JPS5749787A (en) * | 1980-09-08 | 1982-03-23 | Hitachi Ltd | Boiling cooler |
| FR2492169A1 (fr) * | 1980-10-09 | 1982-04-16 | Aerospatiale | Support pour cellule photovoltaique, batterie de cellules photovoltaiques pourvues d'un tel support et generateur solaire pourvu d'une telle batterie |
| DE3307703A1 (de) * | 1983-03-04 | 1984-09-06 | BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau | Dosen-siedekuehleinrichtung fuer leistungshalbleiterelemente |
| FR2588072B1 (fr) * | 1985-09-30 | 1987-12-11 | Jeumont Schneider | Installation de dissipation pour elements semi-conducteurs de puissance |
| US4759403A (en) * | 1986-04-30 | 1988-07-26 | International Business Machines Corp. | Hydraulic manifold for water cooling of multi-chip electric modules |
| DE3719637A1 (de) * | 1987-06-12 | 1988-12-29 | Asea Brown Boveri | Siedekuehleinrichtung fuer halbleiterelemente |
| US4938279A (en) * | 1988-02-05 | 1990-07-03 | Hughes Aircraft Company | Flexible membrane heat sink |
| DE59303632D1 (de) * | 1992-08-04 | 1996-10-10 | Abb Patent Gmbh | Spannverband mit Halbleiterzellen und Kühldosen |
| US5394936A (en) * | 1993-03-12 | 1995-03-07 | Intel Corporation | High efficiency heat removal system for electric devices and the like |
| JPH08340189A (ja) * | 1995-04-14 | 1996-12-24 | Nippondenso Co Ltd | 沸騰冷却装置 |
| SE9604705L (sv) | 1996-12-20 | 1998-06-21 | Ericsson Telefon Ab L M | Förfarande och medel för att arrangera värmeöverföring |
| JP3964580B2 (ja) * | 1999-09-03 | 2007-08-22 | 富士通株式会社 | 冷却ユニット |
| US6611071B2 (en) | 2001-08-17 | 2003-08-26 | Siemens Automotive Inc. | Embedded electronics for high convection cooling in an engine cooling motor application |
| US6980450B2 (en) * | 2002-01-24 | 2005-12-27 | Inverters Unlimited, Inc. | High power density inverter and components thereof |
| US7506682B2 (en) * | 2005-01-21 | 2009-03-24 | Delphi Technologies, Inc. | Liquid cooled thermosiphon for electronic components |
| US20060162903A1 (en) * | 2005-01-21 | 2006-07-27 | Bhatti Mohinder S | Liquid cooled thermosiphon with flexible partition |
| US7077189B1 (en) * | 2005-01-21 | 2006-07-18 | Delphi Technologies, Inc. | Liquid cooled thermosiphon with flexible coolant tubes |
| US8978741B2 (en) * | 2006-02-17 | 2015-03-17 | Hewlett-Packard Development Company, L.P. | Device for reducing temperature variations in plenums |
| KR101440162B1 (ko) * | 2006-06-22 | 2014-09-12 | 바스프 에스이 | 말로노니트릴 화합물 |
| FI122741B (fi) * | 2006-09-29 | 2012-06-15 | Vacon Oyj | Tehomuuttajan tehokomponenttien jäähdytys |
| US20100006132A1 (en) * | 2008-07-14 | 2010-01-14 | Lucent Technologies, Inc. | Stacked Thermoelectric Modules |
| WO2010025129A1 (en) * | 2008-08-25 | 2010-03-04 | Despatch Industries Limited Partnership | Enclosure and method for temperature-sensitive components |
| US9464854B2 (en) * | 2013-02-01 | 2016-10-11 | Dell Products, Lp | Techniques for controlling vapor pressure in an immersion cooling tank |
| ES2608253B1 (es) * | 2015-10-06 | 2018-02-20 | Universitat De Girona | Dispositivo termoeléctrico tubular, instalación termoeléctrica y procedimiento de fabricación correspondiente |
| CN106026617A (zh) * | 2016-07-06 | 2016-10-12 | 中国科学院电工研究所 | 一种集中冷却式变流器 |
| US10966349B1 (en) * | 2020-07-27 | 2021-03-30 | Bitfury Ip B.V. | Two-phase immersion cooling apparatus with active vapor management |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL208738A (US07368563-20080506-C00056.png) * | 1955-07-06 | |||
| CH498488A (de) * | 1969-04-30 | 1970-10-31 | Bbc Brown Boveri & Cie | Kühleinrichtung insbesondere für Halbleiterelemente und Elektronenröhren |
| US3609991A (en) * | 1969-10-13 | 1971-10-05 | Ibm | Cooling system having thermally induced circulation |
| SE382282B (sv) * | 1971-02-13 | 1976-01-19 | Bbc Brown Boveri & Cie | For minst en halvledarskivcell avsett tryckfeste med kylanordning, innefattande vermeror med inre kapillerstruktur. |
| US3864607A (en) * | 1972-03-16 | 1975-02-04 | Programmed Power | Stackable heat sink assembly |
-
1974
- 1974-03-15 JP JP3041074A patent/JPS5512740B2/ja not_active Expired
-
1975
- 1975-03-12 US US05/557,892 patent/US4020399A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US4020399A (en) | 1977-04-26 |
| JPS5512740B2 (US07368563-20080506-C00056.png) | 1980-04-03 |
