JPS50110948A - - Google Patents
Info
- Publication number
- JPS50110948A JPS50110948A JP48100400A JP10040073A JPS50110948A JP S50110948 A JPS50110948 A JP S50110948A JP 48100400 A JP48100400 A JP 48100400A JP 10040073 A JP10040073 A JP 10040073A JP S50110948 A JPS50110948 A JP S50110948A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19722244307 DE2244307C3 (de) | 1972-09-09 | Verfahren zur Herstellung von alkalischen Bädern zur autokatalytischen stromlosen Abscheidung von Kupfer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50110948A true JPS50110948A (enrdf_load_html_response) | 1975-09-01 |
| JPS5549155B2 JPS5549155B2 (enrdf_load_html_response) | 1980-12-10 |
Family
ID=5855884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10040073A Expired JPS5549155B2 (enrdf_load_html_response) | 1972-09-09 | 1973-09-07 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3855141A (enrdf_load_html_response) |
| JP (1) | JPS5549155B2 (enrdf_load_html_response) |
| AT (1) | AT324065B (enrdf_load_html_response) |
| CH (1) | CH606470A5 (enrdf_load_html_response) |
| FR (1) | FR2199009B1 (enrdf_load_html_response) |
| GB (1) | GB1416637A (enrdf_load_html_response) |
| IT (1) | IT993886B (enrdf_load_html_response) |
| SE (1) | SE387966B (enrdf_load_html_response) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3919100A (en) * | 1974-04-24 | 1975-11-11 | Enthone | Alkaline etchant compositions |
| JPS5124537A (en) * | 1974-08-26 | 1976-02-27 | Hitachi Ltd | Etsuchinguyokuno saiseihoho |
| DE2917597A1 (de) * | 1979-04-30 | 1980-11-13 | Siemens Ag | Verfahren zur regenerierung ammoniakalischer aetzloesungen zum aetzen von metallischem kupfer |
| US5013395A (en) * | 1987-08-28 | 1991-05-07 | International Business Machines Corporation | Continuous regeneration of acid solution |
| US5227010A (en) * | 1991-04-03 | 1993-07-13 | International Business Machines Corporation | Regeneration of ferric chloride etchants |
| US5145553A (en) * | 1991-05-06 | 1992-09-08 | International Business Machines Corporation | Method of making a flexible circuit member |
| US6503363B2 (en) * | 2000-03-03 | 2003-01-07 | Seh America, Inc. | System for reducing wafer contamination using freshly, conditioned alkaline etching solution |
| US7404904B2 (en) * | 2001-10-02 | 2008-07-29 | Melvin Stanley | Method and apparatus to clean particulate matter from a toxic fluid |
| SE531697C2 (sv) * | 2007-07-11 | 2009-07-07 | Sigma Engineering Ab | Etsnings- och återvinningsförfarande |
| CN110790416B (zh) * | 2018-08-02 | 2021-11-19 | 广州超邦化工有限公司 | 一种处理化学镀铜废水的方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3438901A (en) * | 1965-10-22 | 1969-04-15 | Neiko I Vassileff | Metal treating bath and chelating agent for metal reactive acid baths |
| US3600244A (en) * | 1969-02-20 | 1971-08-17 | Ibm | Process of etching metal with recovery or regeneration and recycling |
-
1973
- 1973-07-10 SE SE7309677A patent/SE387966B/xx unknown
- 1973-07-13 CH CH1023273A patent/CH606470A5/xx not_active IP Right Cessation
- 1973-08-09 AT AT700673A patent/AT324065B/de not_active IP Right Cessation
- 1973-08-22 US US00390553A patent/US3855141A/en not_active Expired - Lifetime
- 1973-09-05 GB GB4171273A patent/GB1416637A/en not_active Expired
- 1973-09-06 FR FR7332189A patent/FR2199009B1/fr not_active Expired
- 1973-09-06 IT IT28632/73A patent/IT993886B/it active
- 1973-09-07 JP JP10040073A patent/JPS5549155B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| AT324065B (de) | 1975-08-11 |
| JPS5549155B2 (enrdf_load_html_response) | 1980-12-10 |
| US3855141A (en) | 1974-12-17 |
| SE387966B (sv) | 1976-09-20 |
| FR2199009A1 (enrdf_load_html_response) | 1974-04-05 |
| DE2244307B2 (de) | 1975-08-21 |
| DE2244307A1 (de) | 1974-03-28 |
| CH606470A5 (enrdf_load_html_response) | 1978-10-31 |
| FR2199009B1 (enrdf_load_html_response) | 1978-03-10 |
| GB1416637A (en) | 1975-12-03 |
| IT993886B (it) | 1975-09-30 |