JPS4996949A - - Google Patents

Info

Publication number
JPS4996949A
JPS4996949A JP48124099A JP12409973A JPS4996949A JP S4996949 A JPS4996949 A JP S4996949A JP 48124099 A JP48124099 A JP 48124099A JP 12409973 A JP12409973 A JP 12409973A JP S4996949 A JPS4996949 A JP S4996949A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48124099A
Other languages
Japanese (ja)
Other versions
JPS5319300B2 (US07935154-20110503-C00006.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4996949A publication Critical patent/JPS4996949A/ja
Publication of JPS5319300B2 publication Critical patent/JPS5319300B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1518—Vertically held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP12409973A 1972-12-11 1973-11-06 Expired JPS5319300B2 (US07935154-20110503-C00006.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00314080A US3825164A (en) 1972-12-11 1972-12-11 Apparatus for soldering printed circuit cards

Publications (2)

Publication Number Publication Date
JPS4996949A true JPS4996949A (US07935154-20110503-C00006.png) 1974-09-13
JPS5319300B2 JPS5319300B2 (US07935154-20110503-C00006.png) 1978-06-20

Family

ID=23218471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12409973A Expired JPS5319300B2 (US07935154-20110503-C00006.png) 1972-12-11 1973-11-06

Country Status (6)

Country Link
US (1) US3825164A (US07935154-20110503-C00006.png)
JP (1) JPS5319300B2 (US07935154-20110503-C00006.png)
CA (1) CA994611A (US07935154-20110503-C00006.png)
DE (1) DE2359154C2 (US07935154-20110503-C00006.png)
FR (1) FR2210080B1 (US07935154-20110503-C00006.png)
GB (1) GB1410306A (US07935154-20110503-C00006.png)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE30399E (en) * 1977-08-19 1980-09-09 Western Electric Co., Inc. Method for soldering, fusing or brazing
CH656769A5 (de) * 1980-09-09 1986-07-15 Sinter Ltd Vorrichtung zum aufbringen von lot auf leiterplatten.
GB2120964A (en) * 1982-03-25 1983-12-14 Alpha Metals Processes of applying solder
CA1241236A (en) * 1984-05-25 1988-08-30 Donald J. Spigarelli Continuous solder system
US4685605A (en) * 1984-05-25 1987-08-11 The Htc Corporation Continuous solder system
US4684054A (en) * 1985-03-30 1987-08-04 Asahi Chemical Research Laboratory Co., Ltd. Automatic soldering apparatus and method of using the flux to heat the circuit board
JPS61238464A (ja) * 1985-04-13 1986-10-23 Eiichi Miyake 物品加熱装置
DE3539585A1 (de) * 1985-10-11 1987-07-02 Kaspar Eidenberg Verfahren zum verloeten der anschluesse von bauteilen mit den leiterbahnen und loetaugen von leiterplatten und vorrichtung zum durchfuehren dieses verfahrens
DE3607089C1 (de) * 1986-03-01 1987-06-19 Sachs Ersa Kg Loetmaschine
US4766677A (en) * 1986-05-27 1988-08-30 Detrex Chemical Industries, Inc. Method and apparatus for vapor phase soldering
US4778099A (en) * 1987-12-07 1988-10-18 American Telephone And Telegraph Company, At&T Technologies, Inc. Soldering method and apparatus
JPH10125618A (ja) * 1996-10-23 1998-05-15 Fujitsu Ltd 半導体装置の製造方法
US5964395A (en) * 1997-06-09 1999-10-12 Ford Motor Company Predeposited transient phase electronic interconnect media
JP5762137B2 (ja) * 2011-05-27 2015-08-12 上村工業株式会社 めっき方法
CN104014894B (zh) * 2014-06-18 2016-02-03 温州市正邦电子设备有限公司 全自动浸焊机
US10245668B2 (en) * 2016-10-31 2019-04-02 Kulicke And Soffa Industries, Inc Fluxing systems, bonding machines including fluxing systems, and methods of operating the same
CN112004400A (zh) * 2020-09-07 2020-11-27 游隼信息技术科技(苏州)有限公司 一种基于追剪模式的高精度实时动态追踪系统

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3058441A (en) * 1956-10-02 1962-10-16 Sanders Associates Inc Soldering apparatus and method of soldering electrical conductors
US3298588A (en) * 1964-01-23 1967-01-17 Sanders Associates Inc Printed circuit board and machine for soldering same
US3553824A (en) * 1968-05-09 1971-01-12 Western Electric Co Process for eliminating icicle-like formations on soldered circuit substrates

Also Published As

Publication number Publication date
DE2359154A1 (de) 1974-06-12
US3825164A (en) 1974-07-23
FR2210080A1 (US07935154-20110503-C00006.png) 1974-07-05
FR2210080B1 (US07935154-20110503-C00006.png) 1976-04-30
DE2359154C2 (de) 1982-06-24
GB1410306A (en) 1975-10-15
CA994611A (en) 1976-08-10
JPS5319300B2 (US07935154-20110503-C00006.png) 1978-06-20

Similar Documents

Publication Publication Date Title
FR2210080B1 (US07935154-20110503-C00006.png)
JPS4952572A (US07935154-20110503-C00006.png)
FR2194062A1 (US07935154-20110503-C00006.png)
JPS4914219U (US07935154-20110503-C00006.png)
JPS4940761A (US07935154-20110503-C00006.png)
JPS5227920B2 (US07935154-20110503-C00006.png)
JPS48100512U (US07935154-20110503-C00006.png)
JPS4958570U (US07935154-20110503-C00006.png)
CH585978A5 (US07935154-20110503-C00006.png)
CH545959A (US07935154-20110503-C00006.png)
CH567731A5 (US07935154-20110503-C00006.png)
CH569310A5 (US07935154-20110503-C00006.png)
CH585931B5 (US07935154-20110503-C00006.png)
CH583703A5 (US07935154-20110503-C00006.png)
CH567507A5 (US07935154-20110503-C00006.png)
CH583629A5 (US07935154-20110503-C00006.png)
CH583581A5 (US07935154-20110503-C00006.png)
CH583039A5 (US07935154-20110503-C00006.png)
CH566322A5 (US07935154-20110503-C00006.png)
CH566724A5 (US07935154-20110503-C00006.png)
CH581608A5 (US07935154-20110503-C00006.png)
BG18378A1 (US07935154-20110503-C00006.png)
CH567850A5 (US07935154-20110503-C00006.png)
CH579034A5 (US07935154-20110503-C00006.png)
DD100398A1 (US07935154-20110503-C00006.png)