JPS4993863A - - Google Patents
Info
- Publication number
- JPS4993863A JPS4993863A JP552573A JP552573A JPS4993863A JP S4993863 A JPS4993863 A JP S4993863A JP 552573 A JP552573 A JP 552573A JP 552573 A JP552573 A JP 552573A JP S4993863 A JPS4993863 A JP S4993863A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP552573A JPS5516394B2 (ja) | 1973-01-11 | 1973-01-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP552573A JPS5516394B2 (ja) | 1973-01-11 | 1973-01-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4993863A true JPS4993863A (ja) | 1974-09-06 |
| JPS5516394B2 JPS5516394B2 (ja) | 1980-05-01 |
Family
ID=11613591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP552573A Expired JPS5516394B2 (ja) | 1973-01-11 | 1973-01-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5516394B2 (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5598891A (en) * | 1980-01-10 | 1980-07-28 | Nippon Mektron Kk | Method of fabricating flexible printed circuit board |
| JPS6295893A (ja) * | 1985-10-23 | 1987-05-02 | 株式会社日立製作所 | プリント板の製造方法 |
| JPH04128057U (ja) * | 1991-05-16 | 1992-11-20 | 日本ビクター株式会社 | 電機子用リボンコイル |
| EP1075172A4 (en) * | 1998-02-26 | 2003-08-13 | Ibiden Co Ltd | MULTI-LAYER PRINTED CIRCUIT BOARD WITH FULL INTERCONNECT HOLES STRUCTURE |
-
1973
- 1973-01-11 JP JP552573A patent/JPS5516394B2/ja not_active Expired
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5598891A (en) * | 1980-01-10 | 1980-07-28 | Nippon Mektron Kk | Method of fabricating flexible printed circuit board |
| JPS5644597B2 (ja) * | 1980-01-10 | 1981-10-20 | ||
| JPS6295893A (ja) * | 1985-10-23 | 1987-05-02 | 株式会社日立製作所 | プリント板の製造方法 |
| JPH04128057U (ja) * | 1991-05-16 | 1992-11-20 | 日本ビクター株式会社 | 電機子用リボンコイル |
| EP1075172A4 (en) * | 1998-02-26 | 2003-08-13 | Ibiden Co Ltd | MULTI-LAYER PRINTED CIRCUIT BOARD WITH FULL INTERCONNECT HOLES STRUCTURE |
| US7071424B1 (en) | 1998-02-26 | 2006-07-04 | Ibiden Co., Ltd. | Multilayer printed wiring board having filled-via structure |
| US7390974B2 (en) | 1998-02-26 | 2008-06-24 | Ibiden Co., Ltd. | Multilayer printed wiring board with filled viahole structure |
| US7622183B2 (en) | 1998-02-26 | 2009-11-24 | Ibiden Co., Ltd. | Multilayer printed wiring board with filled viahole structure |
| US7737366B2 (en) | 1998-02-26 | 2010-06-15 | Ibiden Co., Ltd. | Multilayer printed wiring board with filled viahole structure |
| US8115111B2 (en) | 1998-02-26 | 2012-02-14 | Ibiden Co., Ltd. | Multilayer printed wiring board with filled viahole structure |
| US8987603B2 (en) | 1998-02-26 | 2015-03-24 | Ibiden Co,. Ltd. | Multilayer printed wiring board with filled viahole structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5516394B2 (ja) | 1980-05-01 |