JPS4992548A - - Google Patents
Info
- Publication number
- JPS4992548A JPS4992548A JP48005147A JP514773A JPS4992548A JP S4992548 A JPS4992548 A JP S4992548A JP 48005147 A JP48005147 A JP 48005147A JP 514773 A JP514773 A JP 514773A JP S4992548 A JPS4992548 A JP S4992548A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48005147A JPS4992548A (enrdf_load_stackoverflow) | 1973-01-10 | 1973-01-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48005147A JPS4992548A (enrdf_load_stackoverflow) | 1973-01-10 | 1973-01-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4992548A true JPS4992548A (enrdf_load_stackoverflow) | 1974-09-04 |
Family
ID=11603170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48005147A Pending JPS4992548A (enrdf_load_stackoverflow) | 1973-01-10 | 1973-01-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4992548A (enrdf_load_stackoverflow) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5853837A (ja) * | 1981-09-25 | 1983-03-30 | Sharp Corp | 電子回路部品の接続方法 |
| JPS60239050A (ja) * | 1984-05-11 | 1985-11-27 | Sharp Corp | 半導体基板の位置合わせ方法 |
| JPS6258649A (ja) * | 1985-09-09 | 1987-03-14 | Fuji Electric Co Ltd | 半導体装置 |
| JPH09284005A (ja) * | 1996-04-15 | 1997-10-31 | Saitama Nippon Denki Kk | 誘電体フィルタ |
| JP2004087850A (ja) * | 2002-08-27 | 2004-03-18 | Asahi Kasei Electronics Co Ltd | 半導体デバイス |
| WO2006123554A1 (ja) * | 2005-05-17 | 2006-11-23 | Matsushita Electric Industrial Co., Ltd. | フリップチップ実装体およびフリップチップ実装方法 |
| JP2017005094A (ja) * | 2015-06-10 | 2017-01-05 | 富士電機株式会社 | 半導体装置 |
| CN110650594A (zh) * | 2019-10-22 | 2020-01-03 | 东莞记忆存储科技有限公司 | 一种新型的铜球焊接方法 |
-
1973
- 1973-01-10 JP JP48005147A patent/JPS4992548A/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5853837A (ja) * | 1981-09-25 | 1983-03-30 | Sharp Corp | 電子回路部品の接続方法 |
| JPS60239050A (ja) * | 1984-05-11 | 1985-11-27 | Sharp Corp | 半導体基板の位置合わせ方法 |
| JPS6258649A (ja) * | 1985-09-09 | 1987-03-14 | Fuji Electric Co Ltd | 半導体装置 |
| JPH09284005A (ja) * | 1996-04-15 | 1997-10-31 | Saitama Nippon Denki Kk | 誘電体フィルタ |
| JP2004087850A (ja) * | 2002-08-27 | 2004-03-18 | Asahi Kasei Electronics Co Ltd | 半導体デバイス |
| WO2006123554A1 (ja) * | 2005-05-17 | 2006-11-23 | Matsushita Electric Industrial Co., Ltd. | フリップチップ実装体およびフリップチップ実装方法 |
| JP2017005094A (ja) * | 2015-06-10 | 2017-01-05 | 富士電機株式会社 | 半導体装置 |
| CN110650594A (zh) * | 2019-10-22 | 2020-01-03 | 东莞记忆存储科技有限公司 | 一种新型的铜球焊接方法 |
| CN110650594B (zh) * | 2019-10-22 | 2021-04-20 | 东莞记忆存储科技有限公司 | 一种铜球焊接方法 |