JPS4990640A - - Google Patents

Info

Publication number
JPS4990640A
JPS4990640A JP10859273A JP10859273A JPS4990640A JP S4990640 A JPS4990640 A JP S4990640A JP 10859273 A JP10859273 A JP 10859273A JP 10859273 A JP10859273 A JP 10859273A JP S4990640 A JPS4990640 A JP S4990640A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10859273A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4990640A publication Critical patent/JPS4990640A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0565—Resist used only for applying catalyst, not for plating itself
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
JP10859273A 1972-12-20 1973-09-28 Pending JPS4990640A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US31689272A 1972-12-20 1972-12-20

Publications (1)

Publication Number Publication Date
JPS4990640A true JPS4990640A (fr) 1974-08-29

Family

ID=23231157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10859273A Pending JPS4990640A (fr) 1972-12-20 1973-09-28

Country Status (8)

Country Link
JP (1) JPS4990640A (fr)
BE (1) BE804148A (fr)
CA (1) CA986772A (fr)
DE (1) DE2363099A1 (fr)
FR (1) FR2211545B1 (fr)
GB (1) GB1429705A (fr)
IT (1) IT993485B (fr)
NL (1) NL7311039A (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59147430A (ja) * 1983-02-10 1984-08-23 Oki Electric Ind Co Ltd 微細回路の形成方法
JPS62185892A (ja) * 1986-02-10 1987-08-14 Kurihara Tokin Kojo:Kk 電気メツキによる立体的模様形成方法
JPS62185895A (ja) * 1986-02-10 1987-08-14 Mitsubishi Motors Corp 部分めつき方法
JPS62185896A (ja) * 1986-02-10 1987-08-14 Mitsubishi Motors Corp 部分めつき方法
JPH02251855A (ja) * 1988-11-18 1990-10-09 Internatl Business Mach Corp <Ibm> ホトレシスト剥離用組成物および剥離方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4668532A (en) * 1984-09-04 1987-05-26 Kollmorgen Technologies Corporation System for selective metallization of electronic interconnection boards
US4782007A (en) * 1987-04-28 1988-11-01 Macdermid, Incorporated Additive method for manufacturing printed circuit boards using aqueous alkaline developable and strippable photoresists
US6524645B1 (en) * 1994-10-18 2003-02-25 Agere Systems Inc. Process for the electroless deposition of metal on a substrate
GB2384493A (en) * 2002-01-23 2003-07-30 Oxley Dev Co Ltd Selective electroless plating of ceramic substrates for use in capacitors
JP5046495B2 (ja) * 2005-04-18 2012-10-10 セーレン株式会社 透明導電性フィルムとその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI3A (fi) * 1843-11-08 Pressjäst

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59147430A (ja) * 1983-02-10 1984-08-23 Oki Electric Ind Co Ltd 微細回路の形成方法
JPS62185892A (ja) * 1986-02-10 1987-08-14 Kurihara Tokin Kojo:Kk 電気メツキによる立体的模様形成方法
JPS62185895A (ja) * 1986-02-10 1987-08-14 Mitsubishi Motors Corp 部分めつき方法
JPS62185896A (ja) * 1986-02-10 1987-08-14 Mitsubishi Motors Corp 部分めつき方法
JPH02251855A (ja) * 1988-11-18 1990-10-09 Internatl Business Mach Corp <Ibm> ホトレシスト剥離用組成物および剥離方法
JPH0544021B2 (fr) * 1988-11-18 1993-07-05 Ibm

Also Published As

Publication number Publication date
CA986772A (en) 1976-04-06
GB1429705A (en) 1976-03-24
NL7311039A (fr) 1974-06-24
IT993485B (it) 1975-09-30
DE2363099A1 (de) 1974-07-04
BE804148A (nl) 1973-12-17
FR2211545A1 (fr) 1974-07-19
FR2211545B1 (fr) 1977-08-12

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